A review: Influence of nano particles reinforced on solder alloy

Soldering and Surface Mount Technology

Volumn 25, Issue 4, 2013, Pages 229-241

  Noor, Ervina Efzan Mhd ^a   Singh, Amares ^a   Chuan, Yap Tze ^a  

^a MULTIMEDIA UNIVERSITY   (Malaysia)

Author keywords

Alloys; Intermetallic compounds; Microstructure; Pb free; Shear strength

Indexed keywords

HIGH TEMPERATURE; LEAD FREE SOLDERS; MICROSTRUCTURAL CONDITIONS; PB-FREE; SOLDER ALLOYS;

ALLOYING; CERIUM ALLOYS; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; LEAD COMPOUNDS; MECHANICAL PROPERTIES; MICROSTRUCTURE; REINFORCEMENT; SHEAR STRENGTH; SOLDERING ALLOYS;

NANOPARTICLES;

EID: 84883416417     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/SSMT-11-2012-0026     Document Type: Review

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