Effect of liquid-liquid structure transition on solidification and wettability of Sn-0.7Cu solder

Journal of Alloys and Compounds

Volumn 505, Issue 2, 2010, Pages 472-475

  Li, Xianfen ^a   Zhang, Fei ^a   Zu, Fangqiu ^a   Lv, Xue ^a   Zhao, Zhenxing ^a   Yang, Dongdong ^a  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Liquid liquid structure transition; Sn 0.7Cu solder; Solidification; Wettability

Indexed keywords

ABNORMAL CHANGE; CU ALLOY; ELECTRICAL RESISTIVITY; FIRST CYCLE; LIQUID STRUCTURES; LIQUID-LIQUIDS; SN-0.7CU SOLDER; SOLIDIFICATION EXPERIMENTS; SOLIDIFICATION MICROSTRUCTURES; SPREADABILITY; STRUCTURAL TRANSITIONS; TEMPERATURE DEPENDENCE; TEMPERATURE-INDUCED; WETTABILITY;

ELECTRIC CONDUCTIVITY; MICROSTRUCTURE; SOLIDIFICATION; TIN;

LIQUIDS;

EID: 77955922178     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.06.087     Document Type: Article

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