Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array

Materials Characterization

Volumn 61, Issue 2, 2010, Pages 212-220

  Garcia, Leonardo R ^a   Osório, Wislei R ^a   Peixoto, Leandro C ^a   Garcia, Amauri ^a  

^a UNIVERSITY OF CAMPINAS   (Brazil)

Author keywords

Dendrite arm spacing; Globular and needle like eutectic morphologies; Mechanical properties; Sn Zn solder alloys; Solidification thermal parameters

Indexed keywords

DENDRITE ARM SPACING; EUTECTIC MORPHOLOGY; NEEDLE-LIKE; SN-ZN SOLDER; THERMAL PARAMETERS;

ALLOYS; CRYSTALLIZATION; DENDRIMERS; DENDRITES (METALLOGRAPHY); EUTECTICS; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; MORPHOLOGY; NEEDLES; SOLIDIFICATION; TENSILE STRENGTH; TIN ALLOYS; ZINC; ZINC ALLOYS;

TIN;

EID: 74449088005     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2009.11.012     Document Type: Article

References (30)

1. Islam R.A., Chan Y.C., Jillek W., and Islam S. Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. Microelectron J 37 (2006) 705-713
2. Yu S.P., Lin H.J., and Hon M.H. Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate. J Mater Sci-Mater El 11 (2000) 461-471
3. Suganuma K., and Kim K.S. Sn-Zn low temperature solder. J Mater Sci-Mater El 18 (2007) 121-127
4. Chen X., Li M., Ren X.X., Hu A.M., and Mao D.L. Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy. J Electron Mater 35 (2006) 1734-1739
5. Wei C., Liu Y.C., Han Y.J., Wan J.B., and Yang K. Microstructures of eutectic Sn-Ag-Zn solder solidified with different cooling rates. J Alloys Compd 464 (2008) 301-305
6. Lin K.L., Chen K.I., Hsu H.M., and Shi C.L. Improvement in the properties of Sn-Zn eutectic based Pb-free solder. Electron. Components and Technology Conference (IEEE) (2003) 658-663
7. McCormack M., Jin S., Chen H.S., and Machusak D.A. New lead-free, Sn-Zn-In solder alloys. J Electron Mater 23 (1994) 687-690
8. Wei C., Liu Y., Gao Z., Xu R., and Yang K. Effects of aging on structural evolution of the rapidly solidified Sn-Ag-Zn eutectic solder. J Alloys Compd 468 (2009) 154-157
9. McCormack M., Jin S., Kammlott G.W., and Chen H.S. New Pb-free solder alloy with superior mechanical properties, Chen. Appl Phys Lett 63 (1993) 15-17
10. Miller C.M., Anderson I.E., and Smith J.F. A viable tin-lead solder substitute: Sn-Ag-Cu. J Electron Mater 23 (1994) 595-601
11. Montesperelli G., Rapone M., Nanni F., Travaglia P., Riani P., Marazza R., et al. Electrochemical and mechanical behaviour of Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn solders. Mater Corros 59 (2008) 662-669
12. McCormack M., and Jin S. Improved mechanical properties in new, Pb-free solder alloys. J Electron Mater 23 (1994) 715-720
13. Shohji I., Gagg C., and Plumbridge W.J. Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy. J Electron Mater 33 (2004) 923-927
14. Sharif A., and Chan Y.C. Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints. Microelectron Eng 84 (2007) 328-335
15. Madeni J., Liu S., and Siewert T. Intermetallics formation and growth at the interface of tin-based solder alloys and copper substrate, 2nd International Brazing and Soldering Conference (ISBC). San Diego. California (2003) 17-19
16. Berry J.T. Effects of solidification conditions on mechanical behavior of Al cast alloys. AFS Trans 78 (1970) 421-428
17. Donelan P. Modelling microstructural and mechanical properties of ferritic ductile cast iron. Mater Sci Technol 16 (2000) 261-269
18. Quaresma J.M., Santos C.A., and Garcia A. Correlation between unsteady-state solidification conditions, dendrite spacings, and mechanical properties of Al-Cu alloys. Metall Mater Trans A 31 (2000) 3167-3178
19. Osório W.R., and Garcia A. Modeling dendritic structure and mechanical properties of Zn Al alloys as a function of solidification conditions. Mater Sci Eng A 325 (2002) 103-111
20. Osório W.R., Santos C.A., Quaresma J.M.V., and Garcia A. Mechanical properties as a function of thermal parameters and microstructure of Zn Al castings. J Mater Process Technol 143 (2003) 703-709
21. Osório W.R., Goulart P.R., Santos G.A., Moura Neto C., and Garcia A. Effect of dendritic arm spacing on mechanical properties and corrosion resistance of Al9wtpctSi and Zn27wtpctAl alloys. Metall Mater Trans 37A (2006) 2525-2538
22. Osório W.R., Spinelli J.E., Cheung N., and Garcia A. Secondary dendrite arm spacing and solute redistribution effects on the corrosion resistance of Al 10 wt% Sn and Al 20 wt% Zn alloys. Mater Sci Eng A 420 (2006) 179-186
23. Garcia L.R., Peixoto L.C., Osorio W.R., and Garcia A. Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn 9%Zn solder alloy. Mater Lett 63 (2009) 1314-1316
24. Goulart P.R., Spinelli J.E., Osório W.R., and Garcia A. Dendritic microstructure affecting mechanical properties and corrosion resistance of an Al-9 wt% Si alloy. Mater Manuf Process 22 (2007) 328-332
25. Santos C.A., Quaresma J.M.V., and Garcia A. Determination of transient interfacial heat transfer coefficients in chill mold castings. J Alloys Compd 319 (2001) 174-186
26. Ferreira I.L., Spinelli J.E., and Garcia A. Gravity-driven inverse segregation during transient upward directional solidification of Sn-Pb hypoeutectic alloys. J Alloys Compd 475 (2009) 396-400
27. Kim Y.S., Kim K.S., Hwang C.W., and Suganuma K. Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys. J Alloys Compd 352 (2003) 233-245
28. Lee J.E., Kim K.S., Inoue M., Jiang J., and Suganuma K. Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy. J Alloys Compd 454 (2008) 310-320
29. Campbell J. Castings. second ed (1991), Butterworth-Heinemann, Oxford, United Kingdom
30. Winterbottom W.L. Converting to lead-free solders: an automotive industry perspective. JOM (1993) 20-24