Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy

Materials Characterization

Volumn 61, Issue 4, 2010, Pages 474-480

  Zou, Changdong ^a   Gao, Yulai ^a   Yang, Bin ^a   Zhai, Qijie ^a  

^a SHANGHAI UNIVERSITY   (China)

Author keywords

Lead free solder alloy; Melting; Nanoparticles; Sn3.0Ag0.5Cu; Solidification

Indexed keywords

ALLOY COMPOSITIONS; BULK ALLOYS; CHEMICAL REDUCTION; COOLING RATES; CU NANOPARTICLES; LEAD-FREE SOLDER ALLOY; MELTING AND SOLIDIFICATION; MELTING TEMPERATURES; MICRO-SIZED PARTICLES; SCANNING RATE; SNPB SOLDER;

ALLOYS; CERIUM ALLOYS; COOLING; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; LEAD; MELTING POINT; METAL MELTING; NANOPARTICLES; SCANNING; SOLIDIFICATION; TIN; TIN ALLOYS;

COPPER ALLOYS;

EID: 77949487700     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2010.02.004     Document Type: Article

References (28)

1. Laurila T., Vuorinen V., and Kivilahti J.K. Interfacial reactions between lead-free solders and common base materials. Mater Sci Eng R 49 (2005) 1
2. Suganuma K. Advances in lead-free electronics soldering. Curr Opin Solid ST M 5 (2001) 55
3. Dong W., Shi Y., Lei Y., Xia Z., and Guo F. Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy. J Mater Sci Mater Electron 20 (2009) 1008
4. Zhang S.S., Zhang Y.J., and Wang H.W. Effect of particle size distributions on the rheology of Sn/Ag/Cu lead-free solder pastes. Mater Des 31 (2010) 594
5. Amagai M., Watanabe M., Omiya M., Kishimoto K., and Shibuya T. Mechanical characterization of Sn-Ag-based lead-free solders. Microelectron Reliab 42 (2002) 951
6. Takagi M. Electron-diffraction study of liquid-solid transition of thin metal films. J Phys Soc Jpn 9 (1954) 359
7. Sambles J.R. An electron microscope study of evaporating gold particles: the Kelvin equation for liquid gold and the lowering of the melting point of solid gold particles. Proc R Soc Lond A 324 (1971) 339
8. Buffat P., and Borel J.P. Size effect on the melting temperature of gold particles. Phys Rev A 13 (1976) 2287
9. Lai S.L., Guo J.Y., Petrova V., Ramanath G., and Allen L.H. Size-dependent melting properties of small tin particles: nanocalorimetric measurements. Phys Rev Lett 77 (1996) 99
10. Zhang M., Efremov M.Y., Schiettekatte F., Olson E.A., Kwan A.T., Lai S.L., et al. Size-dependent melting point depression of nanostructures: nanocalorimetric measurements. Phys Rev B 62 (2000) 10548
11. Jesser W.A., Shneck R.Z., and Gile W.W. Solid-liquid equilibria in nanoparticles of Pb-Bi alloys. Phys Rev B 69 (2004) 144121
12. Jiang H., Moon K.-s., Dong H., Hua F., and Wong C.P. Size-dependent melting properties of tin nanoparticles. Chem Phys Lett 429 (2006) 492
13. Jiang H., Moon K.S., Hua F., and Wong C.P. Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. Chem Mater 19 (2007) 4482
14. Hsiao L.Y., and Duh J.G. Synthesis and characterization of lead-free solders with Sn-3.5Ag-xCu (x = 0.2, 0.5, 1.0) alloy nanoparticles by the chemical reduction method. J Electrochem Soc 152 (2005) J105
15. Jiang H., Moon K.-s., and Wong C.P. Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications. Electronic Components and Technology Conference, ECTC '08 (2008) 1400
16. Yang W., Felton L., and Messler R. The effect of soldering process variables on the microstructure and mechanical properties of eutectic Sn-Ag/Cu solder joints. J Electron Mater 24 (1995) 1465
17. Höne G.W.H., Cammenga H.K., Eysel W., Gmelin E., and Hemminger W. The temperature calibration of scanning calorimeters. Thermochim Acta 160 (1990) 1
18. Neuenfeld S., and Schick C. Verifying the symmetry of differential scanning calorimeters concerning heating and cooling using liquid crystal secondary temperature standards. Thermochim Acta 446 (2006) 55
19. Gao Y., Zou C., Yang B., Zhai Q., Liu J., Zhuravlev E., et al. Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy. J Alloys Compd 484 (2009) 777
20. Algoso P.R., Hofmeister W.H., and Bayuzick R.J. Solidification velocity of undercooled Ni-Cu alloys. Acta Mater 51 (2003) 4307
21. Han X.J., Yang C., Wei B., Chen M., and Guo Z.Y. Rapid solidification of highly undercooled Ni-Cu alloys. Mater Sci Eng A 307 (2001) 35
22. Lu S.Y., Li J.F., and Zhou Y.H. Grain refinement in the solidification of undercooled Ni-Pd alloys. J Cryst Growth 309 (2007) 103
23. Gao Y., Zhuravlev E., Zou C., Yang B., Zhai Q., and Schick C. Calorimetric measurements of undercooling in single micron sized SnAgCu particles in a wide range of cooling rates. Thermochim Acta 482 (2009) 1
24. Gao Y., Zou C., Yang B., and Zhai Q. Fast calorimetric scanning of micro-sized SnAgCu single droplet at a high cooling rate. Sci China Ser E 52 (2009) 1707
25. Mueller B.A., and Perepezko J.H. The undercooling aluminum. Metall Trans A 18 (1987) 1143
26. Kinyanjui R., Lehman L.P., Zavalij L., and Cotts E. Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys. J Mater Res 20 (2005) 2914
27. Sheng H.W., Lu K., and Ma E. Melting and freezing behavior of embedded nanoparticles in ball-milled Al-10 wt.% M (M = In, Sn, Bi, Cd, Pb) mixtures. Acta Mater 46 (1998) 5195
28. Muller M., Wiese S., and Wolter K.J. Solidification behavior of lead-free SnAgCu alloys. 29th International Spring Seminar on Electronics Technology, ISSE '06 (2006) 32