Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder

Materials Science and Engineering: B

Volumn 177, Issue 2, 2012, Pages 197-204

  Koppes, John P ^a   Grossklaus, Kevin A ^b   Muza, Anthony R ^a   Revur, R Rao ^c   Sengupta, Suvankar ^c   Rae, Alan ^d   Stach, Eric A ^a   Handwerker, Carol A ^a  

^a Purdue University   (United States)

^b UNIVERSITY OF MICHIGAN   (United States)

^c MetaMateria Partners   (United States)

^d TPF Enterprises LLC   (United States)

Author keywords

Coalescence; Nanoparticle melting; Pb free; Solder; Thermodynamic size effect; Tin nanoparticles

Indexed keywords

BINARY ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; LEAD ALLOYS; LEAD-FREE SOLDERS; METAL NANOPARTICLES; SYNTHESIS (CHEMICAL); TIN; TIN ALLOYS;

INITIAL MELTING TEMPERATURES; LOWS-TEMPERATURES; NANOPARTICLE MELTING; NANOPARTICLE-SIZE EFFECTS; NANOSOLDER; PB FREE SOLDERS; PB-FREE; SNPB SOLDER; THERMODYNAMIC SIZE EFFECTS; TIN NANOPARTICLES;

MELTING POINT;

EID: 84855758611     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2011.12.019     Document Type: Article

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