Effect of cooling rate on the room-temperature impression. creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders

Materials Science and Engineering: A

Volumn 487, Issue 1-2, 2008, Pages 20-25

  Mahmudi, R ^a   Geranmayeh, A R ^b   Noori, H ^a   Jahangiri, N ^a   Khanbareh, H ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

^b ISLAMIC AZAD UNIVERSITY   (Iran)

Author keywords

Cooling rate; Impression creep; Lead free solder

Indexed keywords

COOLING; CREEP RESISTANCE; METALLOGRAPHIC MICROSTRUCTURE; STRESS CONCENTRATION; TIN ALLOYS;

IMPRESSION CREEP; LEAD-FREE SOLDER;

SOLDERING ALLOYS;

COOLING; CREEP RESISTANCE; METALLOGRAPHIC MICROSTRUCTURE; SOLDERING ALLOYS; STRESS CONCENTRATION; TIN ALLOYS;

EID: 43549096447     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.09.050     Document Type: Article

References (27)