SCOPUS 정보 검색 플랫폼

Soldering and Surface Mount Technology

Volumn 13, Issue 3, 2001, Pages 21-38

Lead-free reflow soldering for electronics assembly

(3) Harrison, M R a Vincent, J H a Steen, H A H b

a Marconi Optical Components (United Kingdom)

b Loctite Multicore (United Kingdom)

Author keywords

Electronics assembly; Lead free soldering; Reflow; Reliability

Indexed keywords

ANTIMONY; BISMUTH; COPPER; ELECTRONIC EQUIPMENT MANUFACTURE; LEAD; NICKEL; RELIABILITY; SOLDERED JOINTS; SURFACE TENSION; THERMAL CYCLING; TIN; TIN ALLOYS;

ELECTRONICS ASSEMBLY; LEAD-FREE REFLOW SOLDERING; SOLDER PASTE; TIN SILVER COPPER ALLOY;

SOLDERING;

EID: 0034767448 PISSN: 09540911 EISSN: None Source Type: Journal
DOI: 10.1108/09540910110407388 Document Type: Article

Times cited : (143)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.