Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

Journal of Alloys and Compounds

Volumn 484, Issue 1-2, 2009, Pages 777-781

  Gao, Yulai ^a   Zou, Changdong ^a   Yang, Bin ^a   Zhai, Qijie ^a   Liu, Johan ^a,b   Zhuravlev, Evgeny ^c   Schick, Christoph ^c  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c UNIVERSITY OF ROSTOCK   (Germany)

Author keywords

Arc technique; Lead free solder; Melting temperature depression; Nanoparticles; SnAgCu

Indexed keywords

ARC TECHNIQUE; CONTROLLED SHAPE; DIRECT CURRENT; ELECTRONIC PRODUCT; EUTECTIC ALLOYS; GIBBS-THOMSON EQUATIONS; HIGH QUALITY; LEAD FREE SOLDERS; LEAD-FREE SOLDER; LEAD-FREE SOLDER ALLOY; MELTING MODEL; MELTING TEMPERATURE DEPRESSION; MELTING TEMPERATURES; ONSET TEMPERATURE; SIZE-DEPENDENT MELTING; SMALL SIZE; SNAGCU; SNAGCU SOLDER; SNPB SOLDER ALLOYS; STRUCTURE AND MORPHOLOGY;

ALLOYS; CAVITY RESONATORS; CERIUM ALLOYS; ELECTRONICS INDUSTRY; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MELTING POINT; METAL MELTING; NANOPARTICLES; SOLDERING ALLOYS;

LEAD;

EID: 70049090201     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.05.042     Document Type: Article

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