Low-temperature solders

Hewlett-Packard Journal

Volumn 47, Issue 4, 1996, Pages 91-98

  Mei, Zequn ^a   Holder, Helen A ^a   Vander Plas, Hubert A ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

LEAD ALLOYS; LOW TEMPERATURE OPERATIONS; LOW TEMPERATURE PROPERTIES; MELTING; PHASE DIAGRAMS; SOLDERING; SURFACE MOUNT TECHNOLOGY; TERNARY SYSTEMS; THERMAL CYCLING; THERMAL EFFECTS; TIN ALLOYS; WETTING;

LOW TEMPERATURE SOLDERS; MELTING TEMPERATURE; PEAK REFLOW TEMPERATURE; SOLDERABILITY; SPREADING TESTS; STEP SOLDERING; THERMAL SHOCK; WETTING BALANCE TEST;

SOLDERING ALLOYS;

EID: 0030214886     PISSN: 00181153     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. J. Seyyedi, "Thermal fatigue of low-temperature solder alloys in insertion mount assembly," Journal of Electronic Packaging, Vol. 115,1993, pp. 305-311.
2. J. Seyyedi, "Thermal fatigue behavior of low melting point solder joints," Journal of Electronic Packaging, Vol. 115,1993, pp. 305-311 (sidebar).
3. Z. Mei, H. Vander Plas, J. Gleason, and J. Baker, Proceedings of the Electronic Materials and Processing Symposium, 1994, Los Angeles, California, pp. 485-495.
4. H.A. Vander Plas, R.B. Cinque, Z. Mei, and J. Baker, "The Assessment of Low-Temperature Fluxes," IIP EAMC Conference Proceedings, 1995.
5. H. Vander Plas, J. Gleason, Z. Mei, and G. Carter, Results of building BLD Ponderosa formatter boards with 58Bi-42Sn solder paste, HP internal report, August 1994.
6. Z. Mei, A failure mechanism of58Bi-42Sn solder joints, HP internal report, September 1994.
7. G. Humpston and D.M. Jacobson, Principles of Soldering and Brazing, ASM International, 1993, p. 63.
8. Choongun Kirn and J.W. Morris, Jr., University of California at Berkeley, unpublished work.
9. R. Strauss and S. Smernos, "Low Temperature Soldering," Circuit World, Vol. 10, no. 3, Spring 1984, pp. 23-25.
10. A. Prince, "A Note on the Bi-In-Pb Ternary Phase Diagram," Materials Research Bulletin, Vol. 11,1976, pp. 1105-1108.
11. J.R. Sovinsky, Pb-free alloys program manager, Indium Corporation of America, communication, February 1994.
12. B.R. Allenby, J.P. Ciccarelli, I. ArtaW, J.R. Fisher, D. Schoenthaler, . T.A. Carroll, D.W. Dahringer, Y. Degani, R.S. Freund, T.E. Graedel, AM. Lyons, J.T. Plews, C. Gherman, H. Solomon, C. Melton, G.G. Munie, and N. Socolowski, "An Assessment of the Use of Lead in Electronic Assembly," Proceedings of Surface Mount International, August 30 to September 3,1992, San Jose, California.
13. Smithells Metals Reference Book, 6th Edition, Butterworths, 1993.
14. Metals Reference and Encyclopedia, The Atlas Publishing Co., Inc., pp. 37-39 and pp. 115-116.