A simplified reflow soldering process model

Journal of Materials Processing Technology

Volumn 150, Issue 1-2, 2004, Pages 134-144

  Whalley, D C ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Measurement; Process modelling; Reflow soldering; Temperature

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; FINITE DIFFERENCE METHOD; FURNACES; OPTIMIZATION; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN; THERMAL CONDUCTIVITY;

AIR FLOW; FURNACE GEOMETRY; PROCESS MODELING; REFLOW SOLDERING;

SOLDERING;

EID: 2642581719     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2004.01.029     Document Type: Conference Paper

References (8)

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2. Whalley D.C., Ogunjimi A.O., Conway P.P., Williams D.J. The process modelling of the infra-red reflow soldering of printed circuit board assemblies. ASME J. Electron. Manuf. 2(1):1992;23-29.
3. Sarvar F., Conway P.P. Effective modelling of the reflow soldering process: basis construction and operation of a process model. IEEE Trans. Components Packaging Manuf. Technol. Part C: Manuf. 21(2):1998;126-133.
4. Eftychiou M.A., Bergman T.L., Masada G.Y. A detailed thermal model of the infra-red reflow soldering process. ASME J. Electron. Packaging. 115:1993;55-62.
5. M.R. Kim, Y.K. Choi, G.B. Lee, I.Y. Chung, J.D. Kim, Thermal investigation of an infra-red reflow furnace with a convection fan, in: Proceedings of the Fifth IEEE Inter-Society Conference on Thermal Phenomena in Electronic Systems, I-THERM, 1996, pp. 211-216.
6. Yu H., Kivilahti J. CFD modelling of the flow field inside a reflow oven. Soldering Surf. Mount Technol. 14(1):2002;38-44.
7. Whalley D.C., Hyslop S.M. A simplified model of the reflow soldering process. Soldering Surf. Mount Technol. 14(1):2002;30-37.
8. D.C. Whalley, A simplified reflow soldering process model, in: Proceedings of the Nineth ISPE International Conference on Concurrent Engineering, Cranfield, July 2002, pp. 313-322.