Properties of low melting point Sn-Zn-Bi solders

Journal of Alloys and Compounds

Volumn 397, Issue 1-2, 2005, Pages 260-264

  Zhou, Jian ^a   Sun, Yangshan ^a   Xue, Feng ^a  

^a SOUTHEAST UNIVERSITY   (China)

Author keywords

Lead free solders; Melting point; Sn alloys; Wetting

Indexed keywords

BISMUTH; LEAD; MELTING; SOLDERING ALLOYS; TENSILE STRENGTH; TIN ALLOYS; WETTING; ZINC;

JOINT STRENGTH; LEAD-FREE SOLDERS; MELTING POINT; SN ALLOYS;

TIN COMPOUNDS;

EID: 19744373254     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2004.12.052     Document Type: Article

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