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Journal of Alloys and Compounds

Volumn 407, Issue 1-2, 2006, Pages 141-149

Reliability studies of Sn-9Zn/Cu solder joints with aging treatment

(2) Yoon, Jeong Won a Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

Author keywords

Interfacial reaction; Joint reliability; Pb free solder; Shear test; Sn 9Zn solder

Indexed keywords

COPPER; RELIABILITY; SHEAR STRENGTH; SURFACE CHEMISTRY; TIN; ZINC;

INTERFACIAL REACTIONS; JOINT RELIABILITY; PB-FREE SOLDER; SHEAR TEST; SN-9ZN SOLDER;

SOLDERED JOINTS;

EID: 29244444506 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2005.06.047 Document Type: Article

Times cited : (39)

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