Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-lAl Pb-free solder pastes on OSP finished printed circuit boards

Journal of Alloys and Compounds

Volumn 459, Issue 1-2, 2008, Pages 225-231

  Lin, Ching Tsung ^a,b   Hsi, Chi Shiung ^a   Wang, Moo Chin ^c   Chang, Tao Chih ^b   Liang, Ming Kann ^b  

^a NATIONAL UNITED UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c KAOHSIUNG MEDICAL UNIVERSITY   (Taiwan)

Author keywords

Brittle fracture; Intermetallic compound (IMC); Joints strength; Lead free solders

Indexed keywords

ADHESIVE PASTES; BRITTLE FRACTURE; MICROSTRUCTURE; OPTICAL MICROSCOPY; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TIN ALLOYS;

ENERGY DISPERSIVE SPECTROMETRY (EDS); JOINTS STRENGTH; SOLDER PASTES;

INTERMETALLICS;

EID: 43549096855     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.05.029     Document Type: Article

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