Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization

Journal of Materials Science and Technology

Volumn 23, Issue 1, 2007, Pages 68-72

  Chen, Hongtao ^a,b   Wang, Chunqing ^a   Li, Mingyu ^a   Tian, Dewen ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b JIAMUSI UNIVERSITY   (China)

Author keywords

Au finish; Intermetallic compound; Sn3.5Ag0.75Cu; Solder joint

Indexed keywords

COPPER ALLOYS; GOLD; INTERMETALLICS; LEAD ALLOYS; MICROSTRUCTURE; NICKEL; SHEAR STRENGTH; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

GOLD FINISH; INTERMETALLIC COMPOUND; SHEAR TEST;

THERMAL CYCLING;

EID: 33947286767     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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