SCOPUS 정보 검색 플랫폼

Volumn 533, Issue , 2012, Pages 64-70

Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature

(3) Prabhu, K N a Deshapande, Parashuram a Satyanarayan, a

a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA (India)

Author keywords

Cooling rate; DBTT; Lead free solder; Microstructure; Solidification; UTS

Indexed keywords

BINARY ALLOYS; COOLING; LEAD ALLOYS; LEAD-FREE SOLDERS; MOLDS; SOLDERED JOINTS; SOLDERING; SOLIDIFICATION; TEMPERATURE; TENSILE STRENGTH; TIN ALLOYS; ZINC ALLOYS;

COOLING MEDIA; COOLING RATES; DUCTILE-BRITTLE TRANSITION TEMPERATURE; DUCTILE-TO-BRITTLE TRANSITION TEMPERATURE; LEAD-FREE SOLDER ALLOY; METALLURGICAL MICROSTRUCTURE; SOLDER ALLOYS; SOLDER JOINTS; SOLIDIFICATION RATE; UTS;

MICROSTRUCTURE;

EID: 84455202307 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2011.11.035 Document Type: Article

Times cited : (37)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.