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Volumn 85, Issue 10, 2008, Pages 1967-1970

Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test

Author keywords

Drop test; Fracture morphology; Lap shear test; Sn 37Pb

Indexed keywords

BRAZING; DROPS; FLUID MECHANICS; FRACTURE FIXATION; LEAD; SPEED; STRAIN RATE; STRESSES; TESTING; TIN ALLOYS; WELDING;

EID: 52149121836     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.06.003     Document Type: Article
Times cited : (25)

References (11)
  • 1
    • 52149124250 scopus 로고    scopus 로고
    • Christian Birzer, et al., Electronic Components and Technology Conference 2005 (ECTC 2005), 255-261.
    • Christian Birzer, et al., Electronic Components and Technology Conference 2005 (ECTC 2005), 255-261.
  • 3
    • 52149086241 scopus 로고    scopus 로고
    • Dongji Xie, et al., 56t Electronic Components and Technology Conference, San Diego, 2006, 865-874.
    • Dongji Xie, et al., 56t Electronic Components and Technology Conference, San Diego, 2006, 865-874.
  • 4
    • 52149124025 scopus 로고    scopus 로고
    • Mash Amagail, et al., 54th Electronic Components and Technology Conference, Las Vegas, 2004, 1304-1309.
    • Mash Amagail, et al., 54th Electronic Components and Technology Conference, Las Vegas, 2004, 1304-1309.
  • 6
    • 52149104124 scopus 로고    scopus 로고
    • JEDEC Standard JESD22-B111.
    • JEDEC Standard JESD22-B111.
  • 7
    • 52149089310 scopus 로고    scopus 로고
    • Michael E. Johnson, et al., Electronic Components and Technology Conference 2007 (ECTC 2007), 536-542.
    • Michael E. Johnson, et al., Electronic Components and Technology Conference 2007 (ECTC 2007), 536-542.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.