메뉴 건너뛰기




Volumn 22, Issue 5, 2009, Pages 625-634

Extension options for 193nm immersion lithography

Author keywords

193nm immersion lithograph; Double exposure; Double patterning; Next generation lithography; Non chemically amplified resist

Indexed keywords


EID: 76649112279     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.22.625     Document Type: Article
Times cited : (8)

References (86)
  • 1
    • 77952270559 scopus 로고    scopus 로고
    • EUV Lithography, Vivek Bakshi ed., SP1E, Press, ISBN, 9780819469649
    • EUV Lithography, Vivek Bakshi ed., SP1E, Press, ISBN, 9780819469649, (2008)
    • (2008)
  • 2
    • 67149102181 scopus 로고    scopus 로고
    • EUV system: moving toward production
    • H. Meiling et al.,EUV system: moving toward production, Proc. SPIE, 7271, 727102 (2009)
    • (2009) Proc. SPIE , vol.7271 , pp. 727102
    • Meiling, H.1
  • 3
    • 67149118060 scopus 로고    scopus 로고
    • Development of resist process for 5-KV multi-beam technology
    • B. Icard, et al., Development of resist process for 5-KV multi-beam technology, Proc. SPIE, 7271, 72710R (2009)
    • (2009) Proc. SPIE , vol.7271
    • Icard, B.1
  • 4
    • 67149097703 scopus 로고    scopus 로고
    • PML2: the maskless multibeam solution for the 22nm node and beyond
    • C. Klein, et al., PML2: the maskless multibeam solution for the 22nm node and beyond, Proc. SPIE, 7271, 72710N (2009)
    • (2009) Proc. SPIE , vol.7271
    • Klein, C.1
  • 5
    • 67149147445 scopus 로고    scopus 로고
    • REBL nanowriter: Reflective Electron Beam Lithography
    • P. Petric et al., REBL nanowriter: Reflective Electron Beam Lithography, Proc. SPIE, 7271, 727107(2009)
    • (2009) Proc. SPIE , vol.7271 , pp. 727107
    • Petric, P.1
  • 6
    • 67149134707 scopus 로고    scopus 로고
    • On the integration of memristors with CMOS using anoimprint lithography
    • Q. Xia, et al., On the integration of memristors with CMOS using anoimprint lithography, Proc. SPIE, 7271, 727106 (2009)
    • (2009) Proc. SPIE , vol.7271 , pp. 727106
    • Xia, Q.1
  • 7
    • 67149091231 scopus 로고    scopus 로고
    • Step and flash imprint lithography for manufacturing patterned media
    • C. Brooks et al.. Step and flash imprint lithography for manufacturing patterned media, Proc. SPIE, 7271, 72711L (2009)
    • (2009) Proc. SPIE , vol.7271 , pp. 72711
    • Brooks, C.1
  • 8
    • 51249087108 scopus 로고    scopus 로고
    • A Novel Resist Freeze Process for Double Imaging
    • D.J. Abdallah, et al., A Novel Resist Freeze Process for Double Imaging, J. Photopol. Sci. Tech., 21(5), 655, (2008)
    • (2008) J. Photopol. Sci. Tech. , vol.21 , Issue.5 , pp. 655
    • Abdallah, D.J.1
  • 9
    • 65849306288 scopus 로고    scopus 로고
    • Demonstration of 32nm half-pitch electrical testable NAND FLASH patterns using self-aligned double patterning
    • S. Sun, et al., Demonstration of 32nm half-pitch electrical testable NAND FLASH patterns using self-aligned double patterning, Proc. SPIE, 7274, 72740D (2009)
    • (2009) Proc. SPIE , vol.7274
    • Sun, S.1
  • 10
    • 51249120513 scopus 로고    scopus 로고
    • Development of materials and processes for double patterning toward 32-nm node 193-nm immersion lithography process
    • S. Tarutani, et al, Development of materials and processes for double patterning toward 32-nm node 193-nm immersion lithography process, J. Photopol. Sci. Tech., 21(5), 685, (2008)
    • (2008) J. Photopol. Sci. Tech. , vol.21 , Issue.5 , pp. 685
    • Tarutani, S.1
  • 11
    • 65849393681 scopus 로고    scopus 로고
    • 32nm and below logic patterning using optimized illumination and double patterning
    • M.C. Smayling, et al, 32nm and below logic patterning using optimized illumination and double patterning, Proc. SPIE, 7274, 72740K (2009)
    • (2009) Proc. SPIE , vol.7274
    • Smayling, M.C.1
  • 12
    • 65849183407 scopus 로고    scopus 로고
    • Advances and challenges in dual-tone development process optimization
    • C. Fonseca, et al, Advances and challenges in dual-tone development process optimization, Proc. SPIE, 1274, 727401 (2009)
    • (2009) Proc. SPIE , vol.1274 , pp. 727401
    • Fonseca, C.1
  • 13
    • 51249105988 scopus 로고    scopus 로고
    • Double Patterning Materials for sub-40nm Application
    • Y.Anno, et al., Double Patterning Materials for sub-40nm Application, J. Photopol. Sci. Tech., 21(5), 691,(2008)
    • (2008) J. Photopol. Sci. Tech. , vol.21 , Issue.5 , pp. 691
    • Anno, Y.1
  • 14
    • 35148869676 scopus 로고    scopus 로고
    • Nonchemically Amplified Resists for Deep-UV lithography
    • R. Ganesan et al. Nonchemically Amplified Resists for Deep-UV lithography, Proc. SPIE, 6519, 65192J(2007)
    • (2007) Proc. SPIE , vol.6519
    • Ganesan, R.1
  • 15
    • 57349090778 scopus 로고    scopus 로고
    • Non-chemically amplified resists for 193 nm lithography
    • I. Nishimura, et al., Non-chemically amplified resists for 193 nm lithography, Proc. SPIE, 6923, 69231C (2008)
    • (2008) Proc. SPIE , vol.6923
    • Nishimura, I.1
  • 16
    • 56349136513 scopus 로고    scopus 로고
    • A New Type of Eco Friendly Resist Based on Nonchemically Amplified System
    • J-Y. Park et al., A New Type of Eco Friendly Resist Based on Nonchemically Amplified System, J. Polymer Sci. A, 7534, (2008)
    • (2008) J. Polymer Sci. A , vol.7534
    • Park, J.-Y.1
  • 17
    • 65849278217 scopus 로고    scopus 로고
    • Non-CA resists for 193 nm immersion lithography: effects of chemical structure on sensitivity
    • I. Blakey, et al., Non-CA resists for 193 nm immersion lithography: effects of chemical structure on sensitivity, Proc. SPIE, 7273, 72733X (2009)
    • (2009) Proc. SPIE , vol.7273
    • Blakey, I.1
  • 18
    • 70350680748 scopus 로고    scopus 로고
    • Study of nanoimprint lithography for applications toward 22nm node CMOS devices
    • I. Yoneda, Mikami, S. Ota, T. Koshiba, T. Ito, M. Nakasugi, T. H. Tatsuhiko, Study of nanoimprint lithography for applications toward 22nm node CMOS devices, Proc. SPIE, 6921, 692104(2008)
    • (2008) Proc. SPIE , vol.6921 , pp. 692104
    • Yoneda, I.1    Ota, M.S.2    Koshiba, T.3    Ito, T.4    Nakasugi, M.5    Tatsuhiko, T.H.6
  • 19
    • 4444318326 scopus 로고    scopus 로고
    • .Impact of Latent Image Quality on Line Edge Roughness in Electron Beam Lithography
    • Y. Masaki, et al. .Impact of Latent Image Quality on Line Edge Roughness in Electron Beam Lithography, J. Applied Phys., 43, Issue 6B, pp. 3739 (2004)
    • (2004) J. Applied Phys. , vol.43 , Issue.6 B , pp. 3739
    • Masaki, Y.1
  • 20
    • 65849248744 scopus 로고    scopus 로고
    • Integration of EUV lithography in the fabrication of 22-nm node devices
    • O. Wood, et al, Integration of EUV lithography in the fabrication of 22-nm node devices, Proc. SPIE, 7271, 727104 (2009)
    • (2009) Proc. SPIE , vol.7271 , pp. 727104
    • Wood, O.1
  • 21
    • 77952262256 scopus 로고    scopus 로고
    • Semiconductor Technology: A Convergence of Technology and Business Models, Plenary Scission
    • B. S. Meyerson, Semiconductor Technology: A Convergence of Technology and Business Models, Plenary Scission, SPIE Advanced Lithography (2009)
    • (2009) SPIE Advanced Lithography
    • Meyerson, B.S.1
  • 22
    • 77952281557 scopus 로고    scopus 로고
    • http://www.semiconductor.net/article/CA6553758.html
  • 23
    • 58149139365 scopus 로고    scopus 로고
    • Extreme-ultraviolet microexposure tool at 0.5 NA for sub-16 nm lithography
    • M. Goldstein, et al, "Extreme-ultraviolet microexposure tool at 0.5 NA for sub-16 nm lithography," Opt. Lett., 33, 2995-2997 (2008)
    • (2008) Opt. Lett. , vol.33 , pp. 2995-2997
    • Goldstein, M.1
  • 24
    • 77952262476 scopus 로고    scopus 로고
    • Reflective Optical System for a photolithography, Scanner Field Projector
    • WO/2008/063825, G02B 27/18
    • C. Manish, and H, Russ, Reflective Optical System for a photolithography, Scanner Field Projector, Patent application WO/2008/063825, G02B 27/18 (2006)
    • (2006) Patent application
    • Manish, C.1    Russ, H.2
  • 25
    • 67149140516 scopus 로고    scopus 로고
    • Demonstration of full field patterning of 32 nm test chips using EUVL
    • G.Vandentopl, et al., Demonstration of full field patterning of 32 nm test chips using EUVL, Proc. SPIE, 7271, 727116 (2009)
    • (2009) Proc. SPIE , vol.7271 , pp. 727116
    • Vandentopl, G.1
  • 26
    • 22144483788 scopus 로고    scopus 로고
    • Line Edge Roughness in Chemically Amplified Resist: Speculation, Simulation and Application
    • N. Yukio, Line Edge Roughness in Chemically Amplified Resist: Speculation, Simulation and Application, J. Photopol. Sci. Technol., 18 (4) 457-465, (2005)
    • (2005) J. Photopol. Sci. Technol. , vol.18 , Issue.4 , pp. 457-465
    • Yukio, N.1
  • 27
    • 0034768090 scopus 로고    scopus 로고
    • Understanding Molecular Level Effects during Post Exposure Processing
    • G. Schmid, et al., Understanding Molecular Level Effects during Post Exposure Processing, Proc. SPIE, 4345 (2001)
    • (2001) Proc. SPIE , pp. 4345
    • Schmid, G.1
  • 28
    • 17144368056 scopus 로고    scopus 로고
    • Chemical Amplification Resists for Microlithography
    • H. Ito, Chemical Amplification Resists for Microlithography, Adv. Polym. Sci., 172: 37-245 (2005)
    • (2005) Adv. Polym. Sci. , vol.172 , pp. 37-245
    • Ito, H.1
  • 29
    • 65849365049 scopus 로고    scopus 로고
    • Development of New Phenylcalix[4]resorcinarene
    • M. Echigo, D. Oguro, Development of New Phenylcalix[4]resorcinarene, Proc. SPIE, 7273 72732Q-1 (2009)
    • (2009) Proc. SPIE , vol.7273
    • Echigo, M.1    Oguro, D.2
  • 30
    • 57349129352 scopus 로고    scopus 로고
    • Water Developable Negative Tone Single Molecule Resists: High Sensitivity Non-Chemically Amplified Resists
    • R. A. Lawson, C-T Lee, W. Yueh, L. Tolbert, C.L. Henderson, Water Developable Negative Tone Single Molecule Resists: High Sensitivity Non-Chemically Amplified Resists, Proc. SPIE, 6923 69231T-2 (2008)
    • (2008) Proc. SPIE , vol.6923
    • Lawson, R.A.1    Lee, C.-T.2    Yueh, W.3    Tolbert, L.4    Henderson, C.L.5
  • 31
    • 0036030912 scopus 로고    scopus 로고
    • Collapse behavior of single layer 193 and 157 nm resists: Use of surfactants in the rinse to realize the sub 130 nm nodes
    • S. Hien et al., Collapse behavior of single layer 193 and 157 nm resists: Use of surfactants in the rinse to realize the sub 130 nm nodes, Proc. SPIE, 4690 (2002)
    • (2002) Proc. SPIE , pp. 4690
    • Hien, S.1
  • 32
    • 35649017569 scopus 로고    scopus 로고
    • Progress in EUV Photoresist Technology
    • T. I. Wallow, et al., Progress in EUV Photoresist Technology, Proc. SPIE, 6533, 653317(2007)
    • (2007) Proc. SPIE , vol.6533 , pp. 653317
    • Wallow, T.I.1
  • 33
    • 24644469033 scopus 로고    scopus 로고
    • Overcoming Pattern Collapse of Ultra High Resolution Dense Lines Obtained with EUV Resists
    • A. Jove, et al., Overcoming Pattern Collapse of Ultra High Resolution Dense Lines Obtained with EUV Resists, Proc. SPIE, 5733, 720 (2005)
    • (2005) Proc. SPIE , vol.5733 , pp. 720
    • Jove, A.1
  • 34
    • 65849212824 scopus 로고    scopus 로고
    • Pattern Transfer Process Development for EUVL
    • D. Kawamura et al., Pattern Transfer Process Development for EUVL, Proc. SPIE, 7273,727310-1,(2009)
    • (2009) Proc. SPIE , vol.7273 , pp. 727310-727311
    • Kawamura, D.1
  • 35
    • 35148838609 scopus 로고    scopus 로고
    • 32 nm Pattern Collapse Modeling with Radial Distance and Rinse Speed
    • J-S. Kim, 32 nm Pattern Collapse Modeling with Radial Distance and Rinse Speed, Proc. SPIE,6519, 65193Y, (2007)
    • (2007) Proc. SPIE , vol.6519
    • Kim, J.-S.1
  • 36
    • 0141834762 scopus 로고    scopus 로고
    • Effects of Processing Parameters on Line Width Roughness
    • B.J. Rice et al., Effects of Processing Parameters on Line Width Roughness, Proc. SPIE, 5039, 384 (2003)
    • (2003) Proc. SPIE , vol.5039 , pp. 384
    • Rice, B.J.1
  • 37
    • 0036030913 scopus 로고    scopus 로고
    • Integration of UTR processes into MPU IC manufacturing flows
    • J. Cobb, et al., "Integration of UTR processes into MPU IC manufacturing flows," Proc. SPIE, 4690, 277-286, (2002)
    • (2002) Proc. SPIE , vol.4690 , pp. 277-286
    • Cobb, J.1
  • 38
    • 50149111332 scopus 로고    scopus 로고
    • LUP for Understanding Trends in EUV Resist Performance
    • LUP for Understanding Trends in EUV Resist Performance, J. Photopol. Sci. Tech., 21(3), 429, (2008)
    • (2008) J. Photopol. Sci. Tech. , vol.21 , Issue.3 , pp. 429
    • Gronheid, R.1
  • 39
    • 65849233850 scopus 로고    scopus 로고
    • EUV lithography for 30nm half pitch and beyond: exploring resolution, sensitivity, and LWR tradeoffs
    • E.S. Putna, EUV lithography for 30nm half pitch and beyond: exploring resolution, sensitivity, and LWR tradeoffs, Proc. SPIE, 7273, 72731L (2009)
    • (2009) Proc. SPIE , vol.7273
    • Putna, E.S.1
  • 40
    • 35148898247 scopus 로고    scopus 로고
    • Some Non-resist Component Contributions to LER and LWR in 193 nm Lithography
    • T. Kudo et al, Some Non-resist Component Contributions to LER and LWR in 193 nm Lithography, Proc. SPIE, 6519, 651941, (2007).
    • (2007) Proc. SPIE , vol.6519 , pp. 651941
    • Kudo, T.1
  • 41
    • 62449234696 scopus 로고    scopus 로고
    • Current benchmarking results of EUV resist at Selete
    • D. Kawamura et al., Current benchmarking results of EUV resist at Selete, Proc. SPIE, 7140, 714008,(2008)
    • (2008) Proc. SPIE , vol.7140 , pp. 714008
    • Kawamura, D.1
  • 42
    • 65849133843 scopus 로고    scopus 로고
    • Feasibility study of non-topcoat resist for 22nm node devices
    • K Sho et al., Feasibility study of non-topcoat resist for 22nm node devices, Proc. SPIE, 7273, 72733B, (2009)
    • (2009) Proc. SPIE , vol.7273
    • Sho, K.1
  • 43
    • 50149106307 scopus 로고    scopus 로고
    • A Resist Materials study for LWR and Resolution improvement in EUV Lithography
    • K. Yamashita, et al., A Resist Materials study for LWR and Resolution improvement in EUV Lithography, j. Photopol. Sci. Tech., 21(3), 439
    • j. Photopol. Sci. Tech. , vol.21 , Issue.3 , pp. 439
    • Yamashita, K.1
  • 44
    • 25144499519 scopus 로고    scopus 로고
    • Resist Blur and Line Edge Roughness
    • G.M Gallatin, Resist Blur and Line Edge Roughness, Proc of SPIE, 5754, 38, (2004)
    • (2004) Proc of SPIE , vol.5754 , pp. 38
    • Gallatin, G.M.1
  • 46
    • 77952245081 scopus 로고    scopus 로고
    • Principles of Photolithography
    • H. Levinson, Principles of Photolithography, SPIE Press, 2001
    • (2001) SPIE Press
    • Levinson, H.1
  • 47
  • 49
    • 67149125975 scopus 로고    scopus 로고
    • Estimation of Cost Comparison of Lithography Technologies at the 22 nm Half-pitch Node
    • A. Wüest, A. J. Hazelton, G. Hughes, Estimation of Cost Comparison of Lithography Technologies at the 22 nm Half-pitch Node, Proc. SPIE, 7271, 72710Y, (2009)
    • (2009) Proc. SPIE , vol.7271
    • Wüest, A.1    Hazelton, A.J.2    Hughes, G.3
  • 50
    • 35148840123 scopus 로고    scopus 로고
    • Double patterning design split implementation and validation for the 32nm node
    • M. Drapeau, V, Wiaux, E. Hendrickx, S. Verhaegen, T. Machida, Double patterning design split implementation and validation for the 32nm node, Proc. SPIE, 6521, 652109 (2007)
    • (2007) Proc. SPIE , vol.6521 , pp. 652109
    • Drapeau, M.1    Wiaux, V.2    Hendrickx, E.3    Verhaegen, S.4    Machida, T.5
  • 51
    • 34648862054 scopus 로고    scopus 로고
    • A litho-only approach to double patterning
    • A. Vanleenhove, D. Van Steenwinckel A litho-only approach to double patterning, Proc. SPIE, 6520, 65202F (2007)
    • (2007) Proc. SPIE , vol.6520
    • Vanleenhove, A.1    Van Steenwinckel, D.2
  • 55
    • 35148844696 scopus 로고    scopus 로고
    • Patterning with amorphous carbon spacer for expanding the resolution limit of current lithography tool
    • Woo-Yung Jung et al., "Patterning with amorphous carbon spacer for expanding the resolution limit of current lithography tool," Proc. SPIE, 6520-48 (2007)
    • (2007) Proc. SPIE , pp. 6520-6548
    • Jung, W.-Y.1
  • 56
    • 65849385973 scopus 로고    scopus 로고
    • 22nm Half-Pitch Patterning by CVD Spacer Self Alignment Double Patterning (SADP)
    • C.Bencher et al., "22nm Half-Pitch Patterning by CVD Spacer Self Alignment Double Patterning (SADP)," Proc. SPIE, 6924-169(2007)
    • (2007) Proc. SPIE , pp. 6924-7169
    • Bencher, C.1
  • 58
    • 77952256862 scopus 로고    scopus 로고
    • http://www.itrs.net/Links/2008ITRS/Home2008.htm
  • 59
    • 65849528344 scopus 로고    scopus 로고
    • Design Rule Scaling: Taking the CPU toward the 16nm node
    • C. Bencher, H. Dai, Y. Chen, ed
    • C. Bencher, H. Dai, Y. Chen, ed Design Rule Scaling: Taking the CPU toward the 16nm node, Proc. SPIE, 7274, 72740G-1, (2009)
    • (2009) Proc. SPIE , vol.7274
  • 60
    • 80455128695 scopus 로고    scopus 로고
    • Low-variability negative and iterative spacer processes for sub-30-nm lines and holes
    • A. Carlson, T-J. King Liu, Low-variability negative and iterative spacer processes for sub-30-nm lines and holes, J. Micro/Nanolith. MEMS MOEMS, 8, 1, 011009, (2009)
    • (2009) J. Micro/Nanolith. MEMS MOEMS , vol.8 , Issue.1 , pp. 011009
    • Carlson, A.1    King Liu, T.-J.2
  • 63
    • 45549103032 scopus 로고    scopus 로고
    • Predicting lithography costs - guidance for £ 32 nm patterning solutions
    • Andrew J. Hazelton et al., "Predicting lithography costs - guidance for £ 32 nm patterning solutions," Proc. SPIE, 7028-128 (2008).
    • (2008) Proc. SPIE , pp. 7028-7128
    • Andrew, J.1    Hazelton2
  • 64
    • 77952284973 scopus 로고    scopus 로고
    • Advancing Moore's Law with Pitch Division, Sematech Workshop on Novel Extensions to Optical Lithography, San Francisco, Ca, USA 9/12/
    • Y. Borodovsky, Advancing Moore's Law with Pitch Division, Sematech Workshop on Novel Extensions to Optical Lithography, San Francisco, Ca, USA 9/12/2007
    • (2007)
    • Borodovsky, Y.1
  • 65
    • 77952251623 scopus 로고    scopus 로고
    • Someday Chips might be made with X-ray, Until then, Double patterning lithography will be the only Game in Town
    • Nov
    • C.A. Mack, Someday Chips might be made with X-ray, Until then, Double patterning lithography will be the only Game in Town, IEEE Spec, 47, Nov. (2008)
    • (2008) IEEE Spec. , vol.47
    • Mack, C.A.1
  • 69
    • 0022493649 scopus 로고
    • Approaches to the design of radiation-sensitive polymeric imaging systems with improved sensitivity and resolution
    • C.G. Willson, H. Ito et al. Approaches to the design of radiation-sensitive polymeric imaging systems with improved sensitivity and resolution. J. Electrochem. Soc. 133(1), 181 (1983)
    • (1983) J. Electrochem. Soc. , vol.133 , Issue.1 , pp. 181
    • Willson, C.G.1    Ito, H.2
  • 70
    • 77952252323 scopus 로고
    • New UV Resists with Negative or Positive Tone
    • C.G. Willson, J.M.J Frechet, "New UV Resists with Negative or Positive Tone," Proc.IEEE, 92-93 (1982)
    • (1982) Proc. IEEE , pp. 92-93
    • Willson, C.G.1    Frechet, J.M.J.2
  • 71
    • 0020938226 scopus 로고    scopus 로고
    • Chemical Amplification in the Design of Dry Developing Resist Materials
    • Ito, Hiroshi; Willson, C. Grant "Chemical Amplification in the Design of Dry Developing Resist Materials," Poly Eng.& Sci,. 23(18) 1012-1018(1983)
    • (1983) Poly Eng.& Sci. , vol.23 , Issue.18 , pp. 1012-1018
    • Ito, H.1    Willson, C.G.2
  • 72
  • 74
    • 35148852769 scopus 로고    scopus 로고
    • Photo-deprotection Resist Based on Photolysis of o-Nitrobenzyl Phenol Ether; Challenge to half-pitch 22 nm using Near-field Lithography
    • T. Ito, A. Terao, Y. Inao, T. Yamaguchi and N. Mizutani, Photo-deprotection Resist Based on Photolysis of o-Nitrobenzyl Phenol Ether; Challenge to half-pitch 22 nm using Near-field Lithography, Proc. SPIE, 6519, 65190J-1 (2007)
    • (2007) Proc. SPIE , vol.6519
    • Ito, T.1    Terao, A.2    Inao, Y.3    Yamaguchi, T.4    Mizutani, N.5
  • 76
    • 0003937505 scopus 로고
    • Diazonaphthoquinone-Based Resists
    • Bellingham, WA
    • R. Dammel, Diazonaphthoquinone-Based Resists, SPIE Press, Bellingham, WA (1993)
    • (1993) SPIE Press
    • Dammel, R.1
  • 78
    • 0024305085 scopus 로고
    • Thermally developable, positive resist systems with high sensitivity
    • H Ito, R. Schwalm, Thermally developable, positive resist systems with high sensitivity. J. Electrochem. Soc, 1989;136(l):24l-5.
    • (1989) J. Electrochem. Soc. , vol.136 , Issue.1
    • Ito, H.1    Schwalm, R.2
  • 79
    • 0020938226 scopus 로고    scopus 로고
    • Chemical amplification in the design of dry developing resist materials
    • H. Ito, C.G. Willson, Chemical amplification in the design of dry developing resist materials, Pol. Eng. Sci., 23 (18) 1012-1018 (2004)
    • (2004) Pol. Eng. Sci. , vol.23 , Issue.18 , pp. 1012-1018
    • Ito, H.1    Willson, C.G.2
  • 80
    • 84985580827 scopus 로고
    • The synthesis and evaluation of cyclic olefin sulfone copolymers and terpolymcrs as electron beam resists
    • Gipstein E, Moreau W, et al. The synthesis and evaluation of cyclic olefin sulfone copolymers and terpolymcrs as electron beam resists. J. Appl. Polym. Sci., 1977;21(3):677-88.
    • (1977) J. Appl. Polym. Sci. , vol.21 , Issue.3 , pp. 677-688
    • Gipstein, E.1    Moreau, W.2
  • 81
    • 56349136513 scopus 로고    scopus 로고
    • A New Type of Eco Friendly Resist Based on Nochemically Amplified System
    • 467534
    • J.H Park, J.M. Yun, J-B. Kim, A New Type of Eco Friendly Resist Based on Nochemically Amplified System, J. Polym. Sci. A, 467534, (2008)
    • (2008) J. Polym. Sci. A
    • Park, J.H.1    Yun, J.M.2    Kim, J.-B.3
  • 84
    • 35148831266 scopus 로고    scopus 로고
    • Sub-10-nm structures written in ultra-thin HSQ resist layers using electron-beam lithography
    • A.E. Grigorescu, M.C. van der Krogt, C.W. Hagen, Sub-10-nm structures written in ultra-thin HSQ resist layers using electron-beam lithography, Proc. SPIE, 6519, 65194A (2007)
    • (2007) Proc. SPIE , vol.6519
    • Grigorescu, A.E.1    van der Krogt, M.C.2    Hagen, C.W.3
  • 86
    • 67349180205 scopus 로고    scopus 로고
    • High resolution, high sensitivity inorganic resists
    • J. Stowers, D.A. Keszler, High resolution, high sensitivity inorganic resists, Micro. Eng. (2009)
    • (2009) Micro. Eng.
    • Stowers, J.1    Keszler, D.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.