Pattern transfer process development for EUVL

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7273, Issue , 2009, Pages

  Kawamura, Daisuke ^a   Tanaka, Yuusuke ^a   Itani, Toshiro ^a   Soda, Eiichi ^a   Oda, Noriaki ^a  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

Author keywords

EUV; EUVl; Hard mask; Pattern transfer; Resist; TEG; Test chip; Under layer

Indexed keywords

EUV; EUVL; HARD MASK; PATTERN TRANSFER; RESIST; TEG; TEST CHIP; UNDER LAYER;

ELECTRON BEAM LITHOGRAPHY; EXTREME ULTRAVIOLET LITHOGRAPHY; MATERIALS; SPIN GLASS; TESTING; THERMOELECTRIC EQUIPMENT; ULTRAVIOLET DEVICES;

PHOTORESISTS;

EID: 65849212824     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.812928     Document Type: Conference Paper

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