Advances and challenges in dual-tone development process optimization

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7274, Issue , 2009, Pages

  Fonseca, Carlos ^a   Somervell, Mark ^a   Scheer, Steven ^a   Printz, Wallace ^a   Nafus, Kathleen ^b   Hatakeyama, Shinichi ^b   Kuwahara, Yuhei ^b   Niwa, Takafumi ^b   Bernard, Sophie ^c   Gronheid, Roei ^c  

^a TOKYO ELECTRON AMERICA INC   (United States)

^b TOKYO ELECTRON LTD   (Japan)

^c IMEC   (Belgium)

Author keywords

Double patterning; Dual tone development; Dual tone imaging; Simulation

Indexed keywords

32-NM NODE; 45-NM HALF-PITCH; 45NM NODE; ALTERNATIVE PROCESS; BASIC PRINCIPLES; CO-OPTIMIZATION; COST BENEFITS; DEVELOPMENT METHOD; DEVELOPMENT PROCESS; DOUBLE PATTERNING; DUAL-TONE DEVELOPMENT; DUAL-TONE IMAGING; ILLUMINATION CONDITIONS; IMMERSION LITHOGRAPHY; IMMERSION SCANNERS; LATENT IMAGES; MANUFACTURING SOLUTIONS; NEGATIVE TONES; OPTICAL LITHOGRAPHY; POSITIVE TONE; PROCESS VARIABLES; RESIST LAYERS; RESIST PROCESS; SIMULATION; SIMULATION RESULT; SUB-100 NM LITHOGRAPHY; TECHNICAL CAPABILITIES;

EDUCATION; KRYPTON; NANOLITHOGRAPHY; NANOTECHNOLOGY; ORGANIC SOLVENTS; PHOTORESISTS;

LITHOGRAPHY;

EID: 65849183407     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.814289     Document Type: Conference Paper

References (8)

1. Hazleton, A., et al., "Exposure Tool Requirements for 32 nm Node: Double Patterning and Alternatives," International Symposium on Immersion Lithography Extensions, 2008.
2. Ebihara, T., et al., "Immersion Exposure System for Double Patterning," International Symposium on Immersion Lithography Extensions, 2008.
3. Hepp, B., et al., "Critical Assessment of Error Budget Components in Double Patterning Immersion Lithography," International Symposium on Immersion Lithography Extensions, 2008.
4. D'have, D., et al., "Immersion Specific Error Contributions to Total Overlay Control," International Symposium on Immersion Lithography Extensions, 2008.
5. Asano, Masafumi et al.; "Sub-100 nm Lithography with KrF Exposure Using Multiple Development Method," Jpn. J. Appl. Phys., Vol.38, 1999.
6. Bernard, S., et al., "Feasibility Study on Dual-tone Development for Frequency Doubling." International Symposium on Immersion Lithography Extensions, 2008.
7. Fonseca, C., et al., "Advances in Process Optimization for Dual-Tone Development as a Double Patterning Technique," International Symposium on Immersion Lithography Extensions, 2008.
8. Tarutani, S., et al., "Development of materials and processes for double patterning toward 32-nm mode l93-nm immersion lithography process," Procedings SPIE, 6923, 2007.