Integration of EUV lithography in the fabrication of 22-nm node devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7271, Issue , 2009, Pages

  Wood, Obert ^a   Koay, Chiew Seng ^b   Petrillo, Karen ^b   Mizuno, Hiroyuki ^c   Raghunathan, Sudhar ^a   Arnold, John ^b   Horak, Dave ^b   Burkhardt, Martin ^b   Mcintyre, Gregory ^b   Deng, Yunfei ^a   Fontaine, Bruno La ^a   Okoroanyanwu, Uzodinma ^a   Tchikoulaeva, Anna ^d   Wallow, Tom ^a   Chen, James H C ^b   Colburn, Matthew ^b   Fan, Susan S C ^b   Haran, Bala S ^b   Yin, Yunpeng ^b  

^a ADVANCED MICRO DEVICES   (United States)

^b IBM   (United States)

^c Toshiba America Inc   (United States)

^d IBM MICROELECTRONICS   (United States)

Author keywords

EUV device integration; EUV mask; EUV OPC; EUV resist process; EUVL; Extreme ultraviolet lithography

Indexed keywords

EUV DEVICE INTEGRATION; EUV MASK; EUV OPC; EUV RESIST PROCESS; EUVL;

LASER PULSES; MASKS; NANOTECHNOLOGY; OPTOELECTRONIC DEVICES; SEMICONDUCTOR DEVICES; SILICON WAFERS; ULTRAVIOLET DEVICES;

EXTREME ULTRAVIOLET LITHOGRAPHY;

EID: 65849248744     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.814379     Document Type: Conference Paper

References (22)

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