Development of resist process for 5 KV multi-beam technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7271, Issue , 2009, Pages

  Icard, B ^a   Rio, D ^a   Veltman, P ^b   Kampherbeek, B ^b   Constancias, C ^a   Pain, L ^a  

^a CEA LETI   (France)

^b MAPPER Lithography BV   (Netherlands)

Author keywords

Lithography; Multi beam; Resists and low electron beam energy

Indexed keywords

CHEMICALLY AMPLIFIED RESIST; COST-INCREASES; EUROPEAN COMMISSION; EUROPEAN COMMUNITY; IC MANUFACTURING; INTEGRATED PROGRAMS; LOW ACCELERATING VOLTAGE; LOW ENERGIES; MACHINE WORKING; MASK LESS; MASK-LESS LITHOGRAPHY; MULTI-BEAM; PENETRATION DEPTH; PROXIMITY CORRECTION; RESIST DEVELOPMENT; RESIST FILMS; RESIST PROCESS; RESISTS AND LOW ELECTRON BEAM ENERGY; SEMICONDUCTOR COMPANIES; SEMICONDUCTOR INDUSTRY; STATE OF THE ART; TECHNOLOGICAL FLOWS;

DATA PROCESSING; ELECTRON BEAM LITHOGRAPHY; ELECTRON BEAMS; PHOTORESISTORS; PHOTORESISTS; SEMICONDUCTOR DEVICE MANUFACTURE;

TECHNOLOGY;

EID: 67149118060     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.813687     Document Type: Conference Paper

References (5)

1. B. J. Lin, Proc. of SPIE Vol. 6520, (2007), 652002-1 - 652002, pp 1-18
2. L. Pain et al, "How succeed in introducing the cost attractive ML2 technology into industry?" Lithography Workshop, December 2007 Puerto Rico
3. L. Pain et al, International SEMATECH Litho forum, May 2008, SAGAMORE
4. Press Release of 12-Dec-08 «MAPPER and CEA-Leti launch an international program on Maskless Lithography for 22nm IC manufacturing and install a MAPPER platform within CEA-Leti premises"
5. Conference EIPBN'08, "Optimum Exposure Parameters for High-Resolution Scanning Electron Beam Lithography », Bryan Cord, Joel Yang and Karl Berggren, Massachusetts Institute of Technology