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Volumn 5753, Issue II, 2005, Pages 720-731

Overcoming pattern collapse of ultra high resolution dense lines obtained with EUV resists

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DEFORMATION; ELECTRON BEAM LITHOGRAPHY; ETCHING; INTERFEROMETRY; PHOTOLITHOGRAPHY; SYNCHROTRONS; ULTRAVIOLET RADIATION;

EID: 24644469033     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.598763     Document Type: Conference Paper
Times cited : (17)

References (19)
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  • 3
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    • Tardif, F.1
  • 13
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  • 14
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  • 15
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    • Advances in Resist technology and processing XX
    • "Measurements of water distribution in thin lithographic films", B.D. Vogt et al., in Advances in Resist technology and processing XX, Proc. of SPIE, Vol. 5376 (2004), pp 56-62
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  • 16
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.