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Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 790-795

Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads

(2) Nah, J W a Paik, K W a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COPPER; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; ELECTROMIGRATION; INTEGRATED CIRCUITS; METALLIZING;

BUMP METALLIZATION SYSTEMS; FLIP CHIP CINTERCONNECTION; SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 0034829101 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.