Effects of UBM thickness on electromigration in Pb-free solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 998-1002

  Yiping, Wu ^a   Jinsong, Zhang ^a   Fengshun, Wu ^a   Bing, An ^a   Boyi, Wu ^a   Lei, Wang ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTROPLATING; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; LEAD; SOLDERING; SUBSTRATES; THERMAL EFFECTS; WSI CIRCUITS;

CHIP BUMP; ELECTRON FLOW; ELECTRON WIND; SOLDER RESIST;

ELECTROMIGRATION;

EID: 10444280788     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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