Joule heating effect on the electromigration lifetimes and failure mechanisms of Sn-3.5Ag solder bump

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1436-1441

  Lee, Jang Hee ^a   Lee, Yong Duk ^a   Park, Young Bae ^a   Yang, Seung Taek ^b   Suh, Min Suk ^b   Chung, Qwan Ho ^b   Byun, Kwang Yoo ^b  

^a Andong National University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; DAMAGE DETECTION; ELECTROMIGRATION; FAILURE ANALYSIS; JOULE HEATING; SCANNING ELECTRON MICROSCOPY; SOLDERING;

CURRENT FLOW DIRECTIONS; ELECTROMIGRATION TESTS; FAILURE MECHANISMS; SOLDER BUMP;

FLIP CHIP DEVICES;

EID: 35348874185     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373984     Document Type: Conference Paper

References (12)

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