메뉴 건너뛰기




Volumn 2005, Issue , 2005, Pages 50-53

Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature

Author keywords

[No Author keywords available]

Indexed keywords

JOULE HEATING; MEAN TIME TO FAILURE (MTTF); SOLDER BUMPS; UNDER BUMP METALLURGY (UBM);

EID: 33746533073     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432044     Document Type: Conference Paper
Times cited : (4)

References (14)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.