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Volumn 2005, Issue , 2005, Pages 50-53
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Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature
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Author keywords
[No Author keywords available]
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Indexed keywords
JOULE HEATING;
MEAN TIME TO FAILURE (MTTF);
SOLDER BUMPS;
UNDER BUMP METALLURGY (UBM);
CONTACT ANGLE;
CURRENT DENSITY;
ELECTROMIGRATION;
FAILURE ANALYSIS;
GROWTH KINETICS;
PRECIPITATION (CHEMICAL);
SOLDERED JOINTS;
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EID: 33746533073
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISAPM.2005.1432044 Document Type: Conference Paper |
Times cited : (4)
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References (14)
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