Electromigration effect on solder bump in Cu/Sn-3Ag-0.5Cu/Cu system

Scripta Materialia

Volumn 55, Issue 10, 2006, Pages 867-870

  Yamanaka, Kimihiro ^a   Tsukada, Yutaka ^a   Suganuma, Katsuaki ^b  

^a KYOCERA CORPORATION   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Electromigration; Soldering

Indexed keywords

CATHODES; COPPER ALLOYS; DEFORMATION; ELECTROMIGRATION; FLIP CHIP DEVICES; NUCLEATION;

CATHODE SIDE; ELECTROMIGRATION TEST; SOLDER BUMP;

SOLDERING ALLOYS;

EID: 33748289546     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.07.053     Document Type: Article

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