Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 287-290

  Hsu, Y C ^a   Shao, T L ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COPPER COMPOUNDS; ELECTROMIGRATION; INTERFACES (MATERIALS); INTERMETALLICS; LEAD-FREE SOLDERS; MODIFIED ATMOSPHERE PACKAGING; SOLDERING; SOLDERING ALLOYS; TIN;

COPPER ATOMS; CURRENT-STRESSING; ELECTROMIGRATION DAMAGE; ELECTRON FLOW; FLIP CHIP SOLDER BUMP; FLIP CHIP TECHNOLOGIES; SOLDER JOINTS; UNDER BUMP METALLIZATION;

FLIP CHIP DEVICES;

EID: 63049116393     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188852     Document Type: Conference Paper

References (9)

1. J. H. Lau, Flip Chip Technology(McGraw-Hill, New York, 1996).
2. J. H. Lau and Shi-Wei Ricky Lee, Chip Scale Package(McGraw-Hill, New York, 1999).
3. C. Y. Liu, Chih Chen, and K. N. Tu, J. Appl. Phys. 88, 5703 (2000).
4. T. Y. Lee and K. N. Tu, J. Appl. Phys. 89, 3189 (2001).
5. Kazuyuki Nakagawa, Shinji Bada, Masaki Watanabe, Hironori Matsushima, Kozo Harada, Eiji Hayashi, ECTC, IEEE Proceedings (2001)
6. J. D. Wu, P. J. Zheng, Kelly Lee, C. T. Chiu, and J. J. Lee, ECTC, IEEE Proceedings, 452 (2002).
7. S. Y. Jang, J. Wolf, W. S. Kwon, K. W. Paik, ECTC, IEEE Proceedings, 1213 (2002).
8. T. Y. Lee and K. N. Tu, J. Appl. Phys. 90, 4502 (2001).
9. C. M. Chen and S. W. Chen, J. Appl. Phys. 90, 1208 (2001).