Effect of electromigration on intermetallic compound formation in Pb-free solder - Cu interfaces

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1206-1212

  Gan, H ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC CURRENTS; ELECTRODES; ETCHING; INTERFACES (MATERIALS); INTERMETALLICS; LITHOGRAPHY; SILICON WAFERS; SOLDERING ALLOYS;

CURRENT STRESSING; SOLID STATE AGING;

ELECTROMIGRATION;

EID: 0036292718     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
2. Electromigration of thin strips of SnPb solder as a function of composition
3. Electromigration in eutectic PbSn solder lines
4. Electromigration studies of flip chip bump solder joints
5. Electromigration of eutectic SnPb solder interconnects for flip chip technology
6. Electromigration of eutectic SnPb and SnAgCu flip chip solder bumps and under-bump-metallization
7. The Al/Ni interfacial reactions under the influence of electric current
8. Electric current effect upon the Sn/Cu and Sn/Ni interfacial reactions
9. Electric current effects on Sn/Ag interfacial reactions
10. Electromigration effect upon the Sn-0.7 wt% Cu/Ni and Sn-3.5 wt% Ag/Ni interfacial reactions
11. Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film
12. Kinetics of interfacial reaction in bimetallic Cu-Sn thin films
13. On the theory of phase growth in the diffusion zone during mutual diffusion in an external electric field
14. Stress generation by electromigration