Kinetics of C4 bump degradation in overly aggressive HTOL

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 60-63

  Master, R N ^a   Blish, R C ^a   Morken, D ^a   Adem, E ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; AGING OF MATERIALS; CHARACTERIZATION; FAILURE ANALYSIS; HIGH TEMPERATURE EFFECTS; HIGH TEMPERATURE TESTING; INTERFACES (MATERIALS); INTERMETALLICS; MATHEMATICAL MODELS; PHASE TRANSITIONS; REACTION KINETICS; SOLDERING;

BLOATING FLOATING INTERMETALLICS; CONTROLLED COLLAPSE CHIP CONNECTION; FLIP CHIP BUMPS; HIGH TEMPERATURE OPERATIONAL LIFE TESTS; PAD LIMITING METALLURGY;

FLIP CHIP DEVICES;

EID: 0034476246     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)