Electromigration characteristic of SnAg 3.0Cu 0.5flip chip interconnection

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1164-1169

  Lee, Chien Chen ^a   Lee, Chang Chun ^a   Chiu, Chien Chia ^a   Chen, Kuo Ming ^b   Kuo, Frank ^c   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^c SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT CROWDING RATIO; FLIP CHIP INTERCONNECTION; SOLDER BUMP;

CURRENT DENSITY; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; INTERMETALLICS; MATHEMATICAL MODELS; SOLDERED JOINTS;

ELECTROMIGRATION;

EID: 33845565384     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645801     Document Type: Conference Paper

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