Electromigration of C4 bumps in ceramic and organic flip-chip packages

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 646-649

  Master, Raj N ^a   Marathe, Amit ^a   Pham, Van ^a   Morken, Dave ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTIC SOLDERS; FLIP CHIP PACKAGES; ORGANIC PACKAGES; SOLDER BUMPS;

CERAMIC MATERIALS; ELECTROMIGRATION; ELECTRONICS PACKAGING; EUTECTICS; FLIP CHIP DEVICES;

ELECTRONIC EQUIPMENT;

EID: 33845598286     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645718     Document Type: Conference Paper

References (3)

1. International Technology Roadmap for Semiconductors, Semiconductor Industry Association, 2001.
2. M. Ding, et al., Electromigration Study of High Lead Solders in Flip-chip Package using the Wheatstone Bridge Method, IRPS 2005
3. R. N. Master, et. al. Kinetics of C4 bump degradation in Overly aggressive HTOL, p. 60-63, ECTC 2000.