Electrothermal coupling analysis of current crowding and Joule heating in flip-chip package assembly

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 254-258

  Kao, Chin Li ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; MICROPROCESSOR CHIPS;

ELECTRICAL PATHS; ELECTROTHERMAL COUPLING;

ELECTRONICS PACKAGING;

EID: 24644437008     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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10. Ye, H. et al, "Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric Current Stressing," Appl. Phys. Lett., Vol. 82, No. 7 (2003), pp. 1045-1047.
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