Electromigration failures of UBM/bump systems of flip-chip packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 452-457

  Wu, J D ^a   Zheng, P J ^a   Lee, Kelly ^a   Chin, C T ^a   Lee, J J ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Electromigration; Flip Chip BGA; HTOL; Joint Reliability; UBM Bump

Indexed keywords

CATHODES; CURRENT DENSITY; DEGRADATION; ELECTROMIGRATION; FLIP CHIP DEVICES; SCANNING ELECTRON MICROSCOPY; SOLDERING;

FLIP-CHIP PACKAGES;

ELECTRONICS PACKAGING;

EID: 0036287032     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Surface mount international conference and exposition