Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 786-791

  Lai, Yi Shao ^a   Chen, Kuo Ming ^b   Lee, Chiu Wen ^a   Kao, Chin Li ^a   Shao, Yu Hsiu ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; ELECTROMIGRATION; FLIP CHIP DEVICES; MATHEMATICAL MODELS; METALLURGY; MORPHOLOGY;

CURRENT CROWDING; ELECTROMIGRATION FATIGUE; ELECTROTHERMAL COUPLING; SOLDER BUMPS;

TIN ALLOYS;

EID: 33845595617     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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