Electromigration reliability of SnAgxCuy flip chip interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 961-967

  Wu, J D ^a   Lee, C W ^a   Zheng, P J ^a   Lee, Jeffrey C B ^a   Li, Simon ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKING (CHEMICAL); ELECTROMIGRATION; ELECTRONICS PACKAGING; EUTECTICS; INTERCONNECTION NETWORKS; SHRINKAGE; SOLDERING; TIN COMPOUNDS;

BENCHMARK CELLS; BUMP INTERFACES; FLIP CHIP PACKAGES; FLIP-CHIP SOLDER;

FLIP CHIP DEVICES;

EID: 10444248743     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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