Electromigration in tin thin film

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 463-467

  Hu, Y C ^a   Wan, S W ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRIC LINES; ELECTROMIGRATION; EPOXY RESINS; FLIP CHIP DEVICES; GRAIN BOUNDARIES; INTEGRATED CIRCUIT INTERCONNECTS; MODIFIED ATMOSPHERE PACKAGING; SCANNING ELECTRON MICROSCOPY; TIN;

ELECTRONIC DEVICE; EXPERIMENT METHODS; FLIP CHIP; HIGH CURRENT DENSITIES; SCANNING ELECTRONS; SURFACE MICROSTRUCTURES; THREE-LAYER STRUCTURES; TIN THIN FILMS;

THIN FILMS;

EID: 84966605187     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188883     Document Type: Conference Paper

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