Flip-chip reliability: Comparative characterization of lead free (Sn/Ag/Cu) and 63Sn/Pb eutectic solder

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1263-1269

  Balkan, Haluk ^a   Patterson, Deborah ^a   Burgess, Guy ^a   Carlson, Craig ^a   Elenius, Peter ^a   Johnson, Michael ^a   Rooney, Brian ^a   Sanchez, Joseph ^a   Stepniak, David ^a   Wood, Jim ^a  

^a Flip Chip Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; EUTECTICS; FLIP CHIP DEVICES; METALLIZING; RELIABILITY; THERMAL CYCLING; THERMAL STRESS;

EUTECTIC SOLDERS; UNDER BUMP METALLIZATION (UBM);

SOLDERING ALLOYS;

EID: 0036294956     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Tutorial: Soft errors induced by alpha particles
2. Low alpha-particle emitting ceramics: What's the lower limit?
3. Lead-free flip chip on board experience
4. Flip chip with lead-free solders on halogen-free microvia substrates
5. Lead free solder for flip chip and CSP applications