Failure mechanism of Sn-Ag-Cu flip-chip solder joints with different Cu weight contents under comparatively low current stressing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1462-1466

  Lai, Yi Shao ^a   Chiu, Ying Ta ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTROMIGRATION; FAILURE MODES; RELIABILITY ANALYSIS; SOLDERED JOINTS; STRESS ANALYSIS;

CURRENT STRESSING; ELECTROMIGRATION RELIABILITY; FAILURE MECHANISMS; UNDER BUMP METALLURGY (UBM);

FLIP CHIP DEVICES;

EID: 35348897774     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373988     Document Type: Conference Paper

References (19)

1. Tu, K. N., "Recent Advances on Electromigration in Very-Large-Scale-Integration of Interconnects," J. Appl. Phys., Vol. 94, No. 9 (2003), pp. 5451-5473.
2. Yen, Y. W. and Chen, S. W., "Phase Equilibria of the Ag-Sn-Cu Ternary System," J. Mater. Res., Vol. 19, No. 8 (2004), pp. 2298-2305.
3. Tu, K. N. et al, "Effect of Current Crowding on Vacancy Diffusion and Void Formation in Electromigration," Appl. Phys. Lett., Vol. 76, No. 8 (2000), pp. 988-990.
4. Yoon, J.-W. et al, "Interfacial Reaction and Mechanical Properties of Eutectic Sn-0.7Cu/Ni BGA Solder Joints During Isothermal Long-term Aging," J. Alloys Comp., Vol. 391, No. 1 -2 (2005), pp. 82-89.
5. th Electron. Comp. Technol. Conf., San Diego, CA, USA, 2006, pp. 641-645.
6. Shao, Y.-H. et al, "Electromigration of 99.3Sn-0.7Cu/96.5Sn- 3Ag-0.5Cu Composite Flip-chip Solder Bumps Bonded on Substrate Pads of Au/Ni/Cu or Cu Metallization," Proc. 2006 Annual Meeting Chin. Soc. Mater. Sci., Tainan, Taiwan, 2006.
7. Lai, Y.-S. et al, "Effect of Test Conditions on Electromigration Reliability of Sn-Ag-Cu Flip-chip Solder Interconnects," J. Electron. Pack., ASME, Vol. 129, No. 1 (2007), pp. 56-62.
8. Lai, Y.-S. and Lee, C.-W., "Electromigration Reliability and Morphologies of 62Sn-36Pb-2Ni and 62Sn-36Pb-2Cu Flip-chip Solder Joints," IEEE Trans. Comp. Pack. TechnoL, in press.
9. Wu, J.-D. et al, "A Study in Flip-chip UBM/Bump Reliability with Effects of SnPb Solder Composition," Microelectron. Reliab., Vol. 46, No. 1 (2006), pp. 41-52.
10. Lai, Y.-S. and Kao, C.-L., "Electrothermal Coupling Analysis of Current Crowding and Joule Heating in Flip-chip Packages," Microelectron. Reliab., Vol. 46, No. 8 (2006), pp. 1357-1368.
11. Lai, Y.-S. and Kao, C.-L., "Calibration of Electromigration Reliability of Flip-chip Packages by Electrothermal Coupling Analysis," J. Electron. Mater., Vol. 35, No. 5 (2006), pp. 972-977.
12. Ye, H. et al, "Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric Current Stressing," Appl. Phys. Lett., Vol. 82, No. 7 (2003), pp. 1045-1047.
13. Huang, A. T. et al, "Thermomigration in SnPb Composite Flip Chip Solder Joints," Appl. Phys. Lett., Vol. 88 (2006), 141911.
14. Huang, A. T. et al, "Effect of the Combination of Electromigration and Thermomigration on Phase Migration and Partial Melting in Flip Chip Composite SnPb Solder Joints," J. Appl. Phys., Vol. 100 (2006), 033512.
15. Ouyang, F.-Y. et al, "Effect of Entropy Production on Microstructure Change in Eutectic SnPb Flip Chip Solder Joints by Thermomigration," Appl. Phys. Lett., Vol. 89 (2006), 221906.
16. Lai, Y-S. and Kao, C.-L, "Characteristics of Current Crowding in Flip-chip Solder Bumps," Microeiectron. Reliab., Vol. 46, No. 5-6 (2006), pp. 915-922.
17. Tsai, C. M. et al, "Local Melting Induced by Electromigration in Flip-chip Solder Joints," J. Electron. Mater., Vol. 35, No. 5 (2006), pp. 1005-1009.
18. Liu, Y.-H. and Lin, K.-L., "Damages and Microstructural Variation of High-Lead and Eutectic SnPb Composite Flip Chip Solder Bumps Induced by Electromigration," J. Mater. Res., Vol. 20, No. 8 (2005), pp. 2184-2193.
19. 0.7 Solder Stripes," J. Appl. Phys., Vol. 98 (2005), 033523.