Reliability issues of Pb-free solder joints in electronic packaging technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1194-1200

  Tu, K N ^a   Zeng, K ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; FLIP CHIP DEVICES; METALLIZING; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; THIN FILMS;

WHISKER GROWTH;

ELECTRONICS PACKAGING;

EID: 0036297033     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008258     Document Type: Article

References (37)

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