Emerging issues in the physics and control of electromigration in SnPb and Pb-free solder bumps

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 72-76

  Rinne, G A ^a  

^a Unitive Electronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTROMIGRATION; ELECTRONICS PACKAGING; LEAD; LEAD-FREE SOLDERS;

ACCELERATED TESTING; CURRENT FLOWS; METAL ATOMS; PASSING ELECTRONS; PB-FREE SOLDER BUMP; RISK MITIGATION; SOLDER BUMP; THIN FILM ALUMINUM;

SOLDERING ALLOYS;

EID: 28444451373     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271493     Document Type: Conference Paper

References (8)

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7. Winter, M., http://www.webelements.com, The University of Sheffield and WebElements Ltd, UK
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