Electromigration in SnPb and Pb-free solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 974-978

  Rinne, Glenn A ^a  

^a Unitive Electronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METAL IONS; PB-FREE SOLDER BUMPS; SOLDER PUMP; VACANCY DENSITY;

CRYSTAL ORIENTATION; CURRENT DENSITY; FUNCTIONS; LATTICE CONSTANTS; LEAD COMPOUNDS; METALS; RISK ASSESSMENT; SOLDERING; TIN COMPOUNDS;

ELECTROMIGRATION;

EID: 10444223783     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. D. Gupta and J. M. Oberschmidt, "Diffusion processes in lead based solders used in microelectronic industry," presented at Proceedings of Design and Reliability of Solders and Solder Interconnections Symposium, Orlando, FL, USA, 1997.
2. M. Tammaro, "Investigation of the temperature dependence in Black's equation using microscopic electromigration modeling," Journal of Applied Physics, vol. 86, pp. 3612-3615, 1999.
3. S. Pekin, "Package Level Electromigration FPBGA Packages," presented at Wafer Level Packaging Seminar at Semicon West 2002, San Francisco, CA, 2002.
4. J. Cho and C. V. Thompson, "Grain size dependence of electromigration-induced failures in narrow interconnects," Applied Physics Letters, vol. 54, pp. 2577-2579, 1989
5. S. Pekin, "Package Level Electromigration FPBGA Packages," presented at Wafer Level Packaging Seminar at Semicon West 2002, San Francisco, CA, 2002.
6. Winter, M., http://www.webelements.com, The University of Sheffield and WebElements Ltd, UK
7. T. Mouthaan, V. Petrescu, W. Schoenmaker, F. Groot, S. Angelescu, J. Niehof, and M. D. Profirescu, "Early resistance change modelling in electromigration," presented at Proceedings of 25th European Solid State Device Research Conference, The Hague, Netherlands, 1995.