The electromagnetic compatibility of integrated circuits - Past, present, and future

IEEE Transactions on Electromagnetic Compatibility

Volumn 51, Issue 1, 2009, Pages 78-100

  Ramdani, Mohamed ^a   Sicard, Etienne ^b   Boyer, Alexandre ^b   Dhia, Sonia Ben ^b   Whalen, James J ^c   Hubing, Todd H ^d   Coenen, Mart ^e   Wada, Osami ^f  

^a ESEO   (France)

^b INSA   (France)

^c UNIVERSITY AT BUFFALO   (United States)

^d CLEMSON UNIVERSITY   (United States)

^e EMCMCC   (Netherlands)

^f KYOTO UNIVERSITY   (Japan)

Author keywords

Emission; History; ICs; Modeling; Roadmap; Standards; Susceptibility

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; ELECTRIC INVERTERS; ELECTROMAGNETISM; INTEGRATED CIRCUITS; PLASTIC MOLDS; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGICAL FORECASTING;

EMISSION; ICS; MODELING; ROADMAP; SUSCEPTIBILITY;

ELECTROMAGNETIC COMPATIBILITY;

EID: 61649084724     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2008.2008907     Document Type: Review

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