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Volumn 2, Issue , 2002, Pages 1037-1042

Radiated emission analysis of power bus noise by using a power current model of an LSI

Author keywords

EMI; LSI; Power current model; Printed circuit board; Simulation

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC POWER SYSTEMS; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FREQUENCY DOMAIN ANALYSIS; LSI CIRCUITS;

EID: 0036383561     PISSN: 01901494     EISSN: None     Source Type: Journal    
DOI: 10.1109/ISEMC.2002.1032839     Document Type: Article
Times cited : (6)

References (15)
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  • 2
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    • H. Irino, H. Wabuka, N. Tamaki, N. Masuda, H. Tohya, "SPICE Simulation of Power Supply Current from LSI on PCB with a Behavioral Model," 1999 Int. Symp. on EMC, Tokyo, pp.224-227, May 1999.
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  • 3
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    • Y. Fukumoto, S. Nakamura, O. Wada and R. Koga, "A Design Method of Decoupling Circuits for a Digital PCB to Reduce High Frequency Current on Power and Ground Planes," 1999 Int. Symp. on EMC, Tokyo, 18P103, pp.9-12, May 1999.
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  • 5
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    • Montreal, Aug
    • Y. Fukumoto, T. Matsuishi, T. Kinoshita, O. Wada, Y. Toyota, R. Koga, "Power current model of LSI and parameter identification for EMI simulation of digital PCB," Proc. of IEEE 2001 EMC Symp., Montreal, pp.1185-1190, Aug. 2001.
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  • 6
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    • Nov
    • Y. Fukumoto, Y. Takahata, O. Wada, Y. Toyota, T. Miyashita, R. Koga, "Power Current Model of LSI/IC Containing Equivalent Internal Impedance for EMI Analysis of Digital Circuits," IEICE Trans. Commun., vol. E84-B, no. 11, pp.3041-3049, Nov. 2001.
    • (2001) IEICE Trans. Commun. , vol.E84-B , Issue.11 , pp. 3041-3049
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  • 7
    • 0029409390 scopus 로고
    • Modeling and analysis of multichip module power supply planes
    • Nov
    • K. Lee and A. Barber, "Modeling and analysis of multichip module power supply planes," IEEE Trans. Comp. Packag. Manufact. Technol., vol. 18, no. 4, pp.628-639, Nov. 1995.
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  • 9
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    • Aug
    • I. Novak, "Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by Dissipative Edge Termination," IEEE Trans. Advanced Package, Vol. 22, Aug. 1999, pp.274-283.
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  • 13
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    • Z.L. Wang, O. Wada, Y. Toyota, R. Koga, "An Improved Closed-Form Expression for Accurate and Rapid Calculation of Power and Ground Plane Impedance in Multilayer PCBs," Proc. of Symp. on Electro-magnetic Theory, EMT-00-68, Toyama, Japan, Oct. 2000.
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  • 14
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  • 15
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.