-
1
-
-
9644302160
-
Power bus decoupling on multilayer printed circuit boards
-
May
-
T. Hubing, J. Drewniak, T.V. Doren, D. Hockanson, "Power bus decoupling on multilayer printed circuit boards," IEEE Trans. on EMC, vol. 37, no. 2, pp.155-166, May 1995.
-
(1995)
IEEE Trans. on EMC
, vol.37
, Issue.2
, pp. 155-166
-
-
Hubing, T.1
Drewniak, J.2
Doren, T.V.3
Hockanson, D.4
-
2
-
-
0000778634
-
SPICE simulation of power supply current from LSI on PCB with a behavioral model
-
Tokyo, May
-
H. Irino, H. Wabuka, N. Tamaki, N. Masuda, H. Tohya, "SPICE Simulation of Power Supply Current from LSI on PCB with a Behavioral Model," 1999 Int. Symp. on EMC, Tokyo, pp.224-227, May 1999.
-
(1999)
1999 Int. Symp. on EMC
, pp. 224-227
-
-
Irino, H.1
Wabuka, H.2
Tamaki, N.3
Masuda, N.4
Tohya, H.5
-
3
-
-
0002159529
-
A design method of decoupling circuits for a digital PCB to reduce high frequency current on power and ground planes
-
Tokyo, 18P103, May
-
Y. Fukumoto, S. Nakamura, O. Wada and R. Koga, "A Design Method of Decoupling Circuits for a Digital PCB to Reduce High Frequency Current on Power and Ground Planes," 1999 Int. Symp. on EMC, Tokyo, 18P103, pp.9-12, May 1999.
-
(1999)
1999 Int. Symp. on EMC
, pp. 9-12
-
-
Fukumoto, Y.1
Nakamura, S.2
Wada, O.3
Koga, R.4
-
4
-
-
0001319332
-
Power current model of digital IC with internal impedance for power decoupling simulation
-
Belgium, Sept
-
O. Wada, Y. Takahata, Y. Toyota, R. Koga, T. Miyashita, Y. Fukumoto, "Power current model of digital IC with internal impedance for power decoupling simulation," Proc. of 4th European Symp. on EMC, Belgium, pp.315-320, Sept. 2000.
-
(2000)
Proc. of 4th European Symp. on EMC
, pp. 315-320
-
-
Wada, O.1
Takahata, Y.2
Toyota, Y.3
Koga, R.4
Miyashita, T.5
Fukumoto, Y.6
-
5
-
-
0035785995
-
Power current model of LSI and parameter identification for EMI simulation of digital PCB
-
Montreal, Aug
-
Y. Fukumoto, T. Matsuishi, T. Kinoshita, O. Wada, Y. Toyota, R. Koga, "Power current model of LSI and parameter identification for EMI simulation of digital PCB," Proc. of IEEE 2001 EMC Symp., Montreal, pp.1185-1190, Aug. 2001.
-
(2001)
Proc. of IEEE 2001 EMC Symp.
, pp. 1185-1190
-
-
Fukumoto, Y.1
Matsuishi, T.2
Kinoshita, T.3
Wada, O.4
Toyota, Y.5
Koga, R.6
-
6
-
-
0035517262
-
Power current model of LSI/IC containing equivalent internal impedance for EMI analysis of digital circuits
-
Nov
-
Y. Fukumoto, Y. Takahata, O. Wada, Y. Toyota, T. Miyashita, R. Koga, "Power Current Model of LSI/IC Containing Equivalent Internal Impedance for EMI Analysis of Digital Circuits," IEICE Trans. Commun., vol. E84-B, no. 11, pp.3041-3049, Nov. 2001.
-
(2001)
IEICE Trans. Commun.
, vol.E84-B
, Issue.11
, pp. 3041-3049
-
-
Fukumoto, Y.1
Takahata, Y.2
Wada, O.3
Toyota, Y.4
Miyashita, T.5
Koga, R.6
-
7
-
-
0029409390
-
Modeling and analysis of multichip module power supply planes
-
Nov
-
K. Lee and A. Barber, "Modeling and analysis of multichip module power supply planes," IEEE Trans. Comp. Packag. Manufact. Technol., vol. 18, no. 4, pp.628-639, Nov. 1995.
-
(1995)
IEEE Trans. Comp. Packag. Manufact. Technol.
, vol.18
, Issue.4
, pp. 628-639
-
-
Lee, K.1
Barber, A.2
-
8
-
-
0033310487
-
Accurate power supply ground plane pair models
-
Aug
-
H.H. Wu, J.W. Meyer, K. Lee, and A. Barber, "Accurate Power Supply Ground Plane Pair Models," IEEE Trans. Advanced Packag., Vol. 22, Aug. 1999, pp.259-266.
-
(1999)
IEEE Trans. Advanced Packag.
, vol.22
, pp. 259-266
-
-
Wu, H.H.1
Meyer, J.W.2
Lee, K.3
Barber, A.4
-
9
-
-
0033310488
-
Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination
-
Aug
-
I. Novak, "Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by Dissipative Edge Termination," IEEE Trans. Advanced Package, Vol. 22, Aug. 1999, pp.274-283.
-
(1999)
IEEE Trans. Advanced Package
, vol.22
, pp. 274-283
-
-
Novak, I.1
-
10
-
-
0032277580
-
Modeling multilayered PCB power bus designs using a MPIE-Based circuit extraction technique
-
Denver, CO, Aug
-
H. Shi, J. Fan, J.L. Drewniak, T.H. Hubing, and T.P. Van Doren, "Modeling Multilayered PCB Power Bus Designs using a MPIE-Based Circuit Extraction Technique," Proceedings of the 1998 IEEE International Symposium on Electromagnetic Compatibility, Denver, CO, Aug. 1998, pp.647-651.
-
(1998)
Proceedings of the 1998 IEEE International Symposium on Electromagnetic Compatibility
, pp. 647-651
-
-
Shi, H.1
Fan, J.2
Drewniak, J.L.3
Hubing, T.H.4
Van Doren, T.P.5
-
11
-
-
33747459272
-
Study of the ground bounce caused by power plane resonances
-
May
-
S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W. Temmerman, "Study of the Ground Bounce caused by Power Plane Resonances," IEEE Trans. Electromagn. Compat., Vol. 40, May 1998, pp.111-119.
-
(1998)
IEEE Trans. Electromagn. Compat.
, vol.40
, pp. 111-119
-
-
Van den Berghe, S.1
Olyslager, F.2
De Zutter, D.3
De Moerloose, J.4
Temmerman, W.5
-
12
-
-
0032649064
-
High-frequency characterization of power/ground-plane structures
-
May
-
C.-T. Lei, R.W. Techentin, and B.K. Gillbert, "High-Frequency Characterization of Power/Ground-Plane Structures," IEEE Trans. Microwave Tech. Theory, Vol. 47, May 1999, pp.562-569.
-
(1999)
IEEE Trans. Microwave Tech. Theory
, vol.47
, pp. 562-569
-
-
Lei, C.-T.1
Techentin, R.W.2
Gillbert, B.K.3
-
13
-
-
0003300114
-
An improved closed-form expression for accurate and rapid calculation of power and ground plane impedance in multilayer PCBs
-
Toyama, Japan, Oct
-
Z.L. Wang, O. Wada, Y. Toyota, R. Koga, "An Improved Closed-Form Expression for Accurate and Rapid Calculation of Power and Ground Plane Impedance in Multilayer PCBs," Proc. of Symp. on Electro-magnetic Theory, EMT-00-68, Toyama, Japan, Oct. 2000.
-
(2000)
Proc. of Symp. on Electro-magnetic Theory
, vol.EMT-00-68
-
-
Wang, Z.L.1
Wada, O.2
Toyota, Y.3
Koga, R.4
-
14
-
-
85013602909
-
-
XFX-3D, INNOVEDA
-
XFX-3D, INNOVEDA, http://www.viewlogic.com/.
-
-
-
-
15
-
-
85013575517
-
-
HFSS
-
HFSS, ANSOFT, http://www.ansoft.com/.
-
-
-
|