Power distribution networks for system-on-package: Status and challenges

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 2, 2004, Pages 286-300

  Swaminathan, Madhavan ^a   Kim, Joungho ^b   Novak, Istvan ^c   Libous, James P ^d  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c SUN MICROSYSTEMS   (United States)

^d IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; CMOS INTEGRATED CIRCUITS; ELECTRIC IMPEDANCE; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTROMIGRATION; FINITE DIFFERENCE METHOD; INDUCTANCE; MICROPROCESSOR CHIPS; MULTILAYERS; PRINTED CIRCUIT BOARDS; TIME DOMAIN ANALYSIS; VOLTAGE REGULATORS;

BALL GRID ARRAY PACKAGES; MIXED SIGNAL SYSTEMS; POWER DELIVERY; POWER DISTRIBUTION; QUAD FLAT BACK PACKAGES;

CHIP SCALE PACKAGES;

EID: 4544321366     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.831897     Document Type: Article

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