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Volumn , Issue , 2007, Pages

Efficiency of embedded on-chip EMI protections to continuous harmonic and fast transient pulses with respect to substrate injection

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN; ELECTRIC INVERTERS; ELECTROMAGNETIC PULSE; ELECTROMAGNETISM; ELECTRONICS INDUSTRY; INTEGRATED CIRCUITS; PLASTIC MOLDS; SUBSTRATES; TECHNICAL PRESENTATIONS;

EID: 47749096370     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2007.161     Document Type: Conference Paper
Times cited : (11)

References (13)
  • 1
    • 4444315422 scopus 로고    scopus 로고
    • Model and verification of triple-well shielding on substrate noise in mixed-signal CMOS ICs
    • September
    • R. Rossi, G. Torelli, and V. Liberali. Model and verification of triple-well shielding on substrate noise in mixed-signal CMOS ICs. In ESSDERC, Portugal, September 2003.
    • (2003) ESSDERC, Portugal
    • Rossi, R.1    Torelli, G.2    Liberali, V.3
  • 3
    • 47749098818 scopus 로고    scopus 로고
    • IEC62132-3 : Direct RF power injection to measure the immunity against conducted RF-disturbances of integrated circuits up to 1 GHz
    • IEC EMC Task Force, IEC, August
    • IEC EMC Task Force. IEC62132-3 : Direct RF power injection to measure the immunity against conducted RF-disturbances of integrated circuits up to 1 GHz. Draft technical report, IEC, August 2001.
    • (2001) Draft technical report
  • 7
    • 47749148674 scopus 로고    scopus 로고
    • IEC61000-4-2 : Electric discharge immunity test
    • IEC EMC Task Force, IEC, 1996
    • IEC EMC Task Force. IEC61000-4-2 : Electric discharge immunity test. Draft technical report, IEC, 1996.
    • Draft technical report
  • 8
    • 4444275609 scopus 로고    scopus 로고
    • Predicting the breakdown behavior of microcontrollers under EMP/UWB impact using a statistical analysis
    • February
    • M. Camp, H. Gerth, H. Garbe, and H. Haase. Predicting the breakdown behavior of microcontrollers under EMP/UWB impact using a statistical analysis, IEEE Transactions on Electromagnetic Compatibility, 46(3):368-379, February 2004.
    • (2004) IEEE Transactions on Electromagnetic Compatibility , vol.46 , Issue.3 , pp. 368-379
    • Camp, M.1    Gerth, H.2    Garbe, H.3    Haase, H.4
  • 10
    • 47749145028 scopus 로고    scopus 로고
    • IEC62132-2 : Immunity test to narrowband disturbances by bulk current injection (BCI), 10 kHz-400 MHz
    • IEC EMC Task Force, IEC, 2001
    • IEC EMC Task Force. IEC62132-2 : Immunity test to narrowband disturbances by bulk current injection (BCI), 10 kHz-400 MHz. Draft technical report, IEC, 2001.
    • Draft technical report
  • 12
    • 0026917844 scopus 로고
    • Low-inductance decoupling capacitor for the thermal conducation modules of the IBM enterprise system/9000 processors
    • September
    • J. N. Humenik, C. L. Eggerding, J. M Oberschmidt, L. L. Wu, and S. G. Pauli. Low-inductance decoupling capacitor for the thermal conducation modules of the IBM enterprise system/9000 processors. IBM J. Res. Develop., 36(5):335-342, September 1992.
    • (1992) IBM J. Res. Develop , vol.36 , Issue.5 , pp. 335-342
    • Humenik, J.N.1    Eggerding, C.L.2    Oberschmidt, J.M.3    Wu, L.L.4    Pauli, S.G.5
  • 13
    • 33748823794 scopus 로고
    • A review of AT& T's POLYHIC multichip module technology
    • Proc. Nat
    • A. V. Shah and al. A review of AT& T's POLYHIC multichip module technology. In in Proc. Nat. Electron. Packag. Prod. Conf., Anaheim, CA, pages 537-539, 1991.
    • (1991) Electron. Packag. Prod. Conf., Anaheim, CA , pp. 537-539
    • Shah, A.V.1    and al2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.