Effects of on-chip and off-chip decoupling capacitors on electromagnetic radiated emission

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 610-614

  Kim, Jonghoon ^a   Kim, Hyungsoo ^a   Ryu, Woonghwan ^a   Kim, Joungho ^a   Yun, Young Hwan ^b   Kim, Soo Hyung ^b   Ham, Seog Heon ^b   An, Hyeong Keon ^b   Lee, Yong Hee ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN FOR TESTABILITY; ELECTRIC FIELDS; ELECTROMAGNETIC PULSE; NETWORK COMPONENTS; PRINTED CIRCUIT BOARDS; CAPACITORS; DIGITAL INTEGRATED CIRCUITS; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTRONICS PACKAGING; PRINTED CIRCUIT DESIGN;

DECOUPLING CAPACITOR; DEVICE UNDER TEST; HIGH-SPEED CIRCUITS; HIGH-SPEED DIGITAL SYSTEMS; OFF-CHIP DECOUPLING CAPACITOR; OPTIMUM PLACEMENT; RADIATED EMISSIONS; TRANSVERSE ELECTROMAGNETIC CELL (TEM);

SPICE; INTEGRATED CIRCUIT LAYOUT;

DECOUPLING CAPACITORS; HIGH SPEED DIGITAL SYSTEMS;

EID: 0031625754     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678758     Document Type: Conference Paper

References (8)

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8. TESCOM Company Limited, Mini TEM Cell TC-5010A Operating Manual and Technical Note 7.