Power distribution system design methodology and capacitor selection for modem cmos technology

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 284-291

  Smith, Larry D ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

Ceramic capacitor equivalent series resistance; CMOS; Power distribution system; SPICE

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTRIC POWER DISTRIBUTION; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRIC RESISTANCE; EQUIVALENT CIRCUITS; MATHEMATICAL MODELS;

EQUIVALENT SERIES RESISTANCE (ESR); SOFTWARE PACKAGE SPICE;

CMOS INTEGRATED CIRCUITS;

EID: 0033343078     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784476     Document Type: Article

References (6)

1. L. D. Smith, "Packaging and power distribution design considerations for a Sun Micosystems desktop workstation," in Proc. Elect. Perform. Elect. Packag. Conf., Oct. 1997.
2. W. D. Becker et al., "Modeling, simulation and measurement of midfrequency simultaneous switch noise in computer systems," IEEE Trans. Comp., Packag., Manufact. Technol. B. vol. 21, pp. 286-297, May 1998.
3. L. D. Smith, "Decoupling capacitor calculations for CMOS circuits," in Proc. Elect. P erf. Elect. Packag. Conf., Nov. 1994.
4. K. Y. Chen, W. D. Brown, and L. W. Schaper, "Modeling and simulation of thin film decoupling capacitors," in Proc. Elect. Perform. Electric. Packag. Conf., Oct. 1998.
5. T. Roy, L. Smith, and J. Prymak, "ESR and ESL of ceramic capacitor applied to decoupling applications," in Proc. Elect. Perform. Elect. Packag. Conf., Oct. 1998.
6. L. D. Smith, R. Anderson, D. Forehand, N. O'Sullivan, and T. Roy, "Power plane analysis for CMOS power distribution systems," to be submitted.