Behavior of switching noise and electromagnetic radiation in relation to package properties and on-chip decoupling capacitance

17th International Zurich Symposium on Electromagnetic Compatibility, 2006

Volumn 2006, Issue , 2006, Pages 568-573

  Sudo, Toshio ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CMOS INTEGRATED CIRCUITS; ELECTROMAGNETIC WAVES; LSI CIRCUITS; SPURIOUS SIGNAL NOISE; SWITCHING CIRCUITS;

CORE CIRCUIT; FILTERING COMPONENT; ON-CHIP DECOUPLING CAPACITANCE; OUTPUT CIRCUITS;

CHIP SCALE PACKAGES;

EID: 33751022257     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/emczur.2006.214998     Document Type: Conference Paper

References (13)

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