Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4979, Issue , 2003, Pages 1-19

  Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROACTUATORS; MICROSENSORS; PROCESS CONTROL; SILICON WAFERS;

ENVIRONMENTAL MONITORING; INTEGRATED MICROSYSTEMS; MICROPACKAGING; VACUUM MICROPACKAGING; WAFER-LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 0042564493     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.484953     Document Type: Conference Paper

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